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A kind of silicone resin composition and use thereof

A technology of resin composition and silicone, which is applied in the field of silicone resin composition and prepreg containing it, laminated board and copper clad laminate, can solve the problem of poor peel strength of silicone resin composition, copper foil, Low mechanical strength and other problems, to achieve the effect of reducing internal stress, improving peel strength, and improving toughness

Active Publication Date: 2020-03-13
GUANGDONG SHENGYI SCI TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, silicone laminates also have some disadvantages due to their own chemical composition: long curing time, high curing temperature, low mechanical strength, poor peel strength with copper foil, poor bonding strength between layers and low bending strength, etc. shortcoming
However, in this prior art, organoepoxysilane is a low-molecular coupling agent with a molecular weight of 100-2000, and its main purpose is to improve the compatibility between epoxy resin and silicone resin, and does not mention the Improvement of the toughness of the composition

Method used

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  • A kind of silicone resin composition and use thereof
  • A kind of silicone resin composition and use thereof
  • A kind of silicone resin composition and use thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0051] Weigh 100 parts of methyl phenyl silicone resin with R / Si=1.6 (molar ratio), Ph / (Me+Ph)=0.7 (molar ratio), dissolve in 100 parts of toluene solvent, and weigh 0.0001 zinc isooctanoate catalyst, 0.5 parts of Z-6040 (manufactured by Dow Corning in the United States), and 4.0 parts of epoxy-modified silicone polymer with a number average molecular weight of 2300 are put into the silicone resin solution, and after stirring for 2 hours, the silicone resin gel is obtained. liquid.

[0052] The impregnated weight with this silicone resin glue is 104g / cm 2 The glass fiber cloth was dried at 110°C for 10 minutes to obtain a prepreg with a resin content of 58%. Laminate 4 sheets of prepregs, arrange 35μ electrolytic copper foil on the upper and lower surfaces of the laminate, and place them at 200°C with a surface pressure of 30kgf / cm 2 , Under vacuum below 30mmHg, press molding for 120min to obtain a double-sided copper-clad laminate with a thickness of 0.5mm.

Embodiment 2

[0054] Weigh 100 parts of methyl phenyl silicone resin with R / Si=1.3 (molar ratio), Ph / (Me+Ph)=0.3 (molar ratio), dissolve in 100 parts of toluene solvent, and weigh 0.13g of aluminum acetylacetonate, 1.0 part of KBM-503 (manufactured by Shin-Etsu Chemical in Japan), 0.5 part of BYK-903 (manufactured by BYK in Germany), 10 parts of epoxy-modified silicone polymer with a number average molecular weight of 10000, put into silicon In the resin solution, after stirring evenly, add 30.0 parts of silicon dioxide, stir at room temperature for 2 hours, and emulsify for 20 minutes to obtain a silicone resin glue.

[0055] Except for using the resin glue solution, the same procedure as in Example 1 was carried out to obtain a prepreg and a double-sided copper-clad laminate with a thickness of 0.5 mm.

Embodiment 3

[0057] Weigh 100 parts of methyl silicone resin with R / Si=1.1 (molar ratio), Ph / (Me+Ph)=0 (molar ratio), dissolve in 100 parts of toluene solvent, and weigh 0.3g after the dissolution is complete KH-550 (China, Hubei Wuda Organic Silicon New Materials Co., Ltd.), 2.0 parts of Z-6040 (USA, manufactured by Dow Corning), 1.0 parts of BYK-903 (Germany, manufactured by BYK), 20.0 parts of epoxy with a number average molecular weight of 45000 Put the modified silicone polymer into the silicone resin solution, stir evenly, add 100 parts of fused silica powder and 80.0 parts of alumina, stir at room temperature for 2 hours, and emulsify for 20 minutes to obtain a silicone resin glue.

[0058] Except for using the resin glue, the same procedure as in Example 1 was carried out to obtain a prepreg and a double-sided copper-clad laminate with a thickness of 0.5 mm.

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Abstract

The invention relates to a silicone resin composition and uses thereof. The composition includes following components by weight: 100 parts of silicone resin, 3-20 parts of epoxy-modified silicone polymer, 0.0001-2.0 parts of a catalyst and 0.1-10 parts of an auxiliary agent. The number-average molecular weight of the epoxy-modified silicone polymer is 2200-50000. The epoxy-modified silicone polymer is added as a toughening modifier to improve toughness of the composition and to reduce and eliminate cracks generated after silicone resin laminated plates are cured. The molecular chain of the epoxy-modified silicone polymer comprises silicon and oxygen groups, thus ensuring good compatibility with the silicone resin, reducing the inner stress of the silicone resin, and reducing and eliminating cracks generated after the silicone resin is cured. The molecular chain contains an epoxy group, thus improving stripping strength between a high-pressure laminated plate and copper foil, and enhancing acid and alkali resistance, resistance to chemical agents, and other properties of the silicone resin composition.

Description

technical field [0001] The invention belongs to the technical field of copper-clad laminates, and relates to a silicone resin composition and its application, in particular to a silicone resin composition and prepregs, laminates and copper-clad laminates containing it Background technique [0002] When using silicone resin to prepare laminates or copper-clad laminates, although silicone resin laminates have advantages that ordinary epoxy resin laminates do not have: excellent water repellency, high and low temperature resistance, weather aging resistance, electrical insulation and weather resistance, Moreover, it is flame retardant and halogen-free and phosphorus-free. However, silicone laminates also have some disadvantages due to their own chemical composition: long curing time, high curing temperature, low mechanical strength, poor peel strength with copper foil, poor bonding strength between layers and low bending strength, etc. shortcoming. At the same time, the silic...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L83/04C08K7/14C08K3/36C08K3/22B32B27/04B32B15/08
Inventor 叶素文唐国坊徐莹
Owner GUANGDONG SHENGYI SCI TECH