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A kind of repair method of laser cutting damage on glass surface

A laser cutting and glass surface technology, applied in the direction of coating, etc., can solve the problems affecting the yield rate of glass product processing, and achieve the effects of improving surface flatness, preventing crack expansion, and strengthening penetration strength

Active Publication Date: 2020-01-21
INNO LASER TECH CORP LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] For this reason, the technical problem to be solved by the present invention is that the traditional laser cutting glass is easy to produce tiny damage on the cutting surface, which affects the yield rate of post-processing of glass products, so a method for repairing laser cutting damage on the glass surface is proposed

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  • A kind of repair method of laser cutting damage on glass surface
  • A kind of repair method of laser cutting damage on glass surface

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Experimental program
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Effect test

Embodiment 1

[0027] The present embodiment provides a repair method for laser cutting damage on the glass surface, which includes the following steps:

[0028] a. Provide a piece of laser-cut glass, and cut a piece of larger-sized glass with an ultrafast laser, wherein the wavelength of the ultrafast laser can be 1064nm, 1030nm, 532nm or 515nm, and the power is 10W;

[0029] b. Selective coating of a layer of SiO on the surface of the laser cut section of the glass obtained in step a 2 sol layer, the SiO 2 The SiO used in the sol layer 2 Sol is an organic compound (Sol-gel) containing Si element, which will decompose and form SiO when heated to 300-500°C 2 , and other elements such as potassium and / or sodium can also be added according to the glass composition. In this embodiment, the coated SiO 2 The thickness of the sol layer is 1 micron;

[0030] c. Coating the section with SiO 2 The glass of the sol layer was placed in an oven and dried at 60°C for 0.5h to obtain dry SiO 2 Sol la...

Embodiment 2

[0034] The present embodiment provides a repair method for laser cutting damage on the glass surface, which includes the following steps:

[0035] a. Provide a piece of laser-cut glass, and cut a piece of larger-sized glass with an ultrafast laser, wherein the wavelength of the ultrafast laser can be 1064nm, 1030nm, 532nm or 515nm, and the power is 30W;

[0036] b, the outer surface of the glass obtained in step a is coated with a layer of SiO 2 sol layer, the SiO 2 The SiO used in the sol layer 2 The sol in the sol is an organic compound (Sol-gel) containing Si element, which will decompose and form SiO when heated to 300-500°C 2 , In addition, potassium and / or sodium elements can also be added according to the glass composition. In this embodiment, the coated SiO 2 The thickness of the sol layer is 20 microns;

[0037] c. Coating the section with SiO 2 The glass of the sol layer was placed in an oven and dried at 120°C for 0.1h to obtain dry SiO 2 Sol layer;

[0038] ...

Embodiment 3

[0041] The present embodiment provides a repair method for laser cutting damage on the glass surface, which includes the following steps:

[0042] a. Provide a piece of laser-cut glass, and cut a piece of larger-sized glass with an ultrafast laser, wherein the wavelength of the ultrafast laser can be 1064nm, 1030nm, 532nm or 515nm, and the power is 15W;

[0043] b, the outer surface of the glass obtained in step a is coated with a layer of SiO 2 sol layer, the SiO 2 The SiO used in the sol layer 2 The sol in the sol is an organic compound (Sol-gel) containing Si element, which will decompose and form SiO when heated to 300-500°C 2 , In addition, potassium or sodium elements can also be added according to the glass composition. In this embodiment, the coated SiO 2 The thickness of the sol layer is 20 microns;

[0044] c. Coating the section with SiO 2 The glass of the sol layer was placed in an oven and dried at 80°C for 0.3h to obtain dry SiO 2 Sol layer;

[0045] d. Usin...

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Abstract

A method for repairing laser cutting damage on glass surface, comprising the following steps: a, providing a piece of laser-cut glass; b, coating at least one surface comprising a laser cutting section with SiO2 sol; c, drying the SiO2 sol layer formed in the step b; d, sintering the SiO2 sol layer on the surface comprising the laser cutting section to form a SiO2 layer; and e, annealing the SiO2 layer. First, the glass surface comprising the cutting section is coated with a SiO2 sol layer; and then, the SiO2 sol layer is sintered into a SiO2 layer so as to form a SiO2 protective layer on the surface comprising the cutting section to repair a defect on the section, thereby avoiding enlarging of cracks and edge breakage due to thermal bending in a subsequent thermal treatment process; finally, the strength of a SiO2 repairing layer and the permeation strength thereof in the defect are enhanced by means of annealing.

Description

technical field [0001] The invention belongs to the technical field of laser cutting, in particular to a method for repairing slight damage to the surface of glass material after laser cutting. Background technique [0002] Laser cutting is a method of using a high-power-density laser beam to irradiate the surface of the material to be cut, so that the material to be cut is heated to the vaporization temperature and evaporates to form holes. Material cutting. Due to the small laser spot, high energy density, and fast cutting speed, better cutting quality can be obtained. Laser cutting technology has been widely used in various fields and can be used to process various materials such as glass, metal, cloth, wood, and plastic. [0003] At normal temperature, glass is a brittle material with non-ductility. For a long time, glass has been cut with diamond tools: first scribing on the glass surface, and then breaking it by hand. This method has low material utilization rate and ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C03C17/23
CPCC03C17/23C03C2217/213C03C2217/90C03C2218/113C03C2218/32
Inventor 张杰欧志龙马明鸿
Owner INNO LASER TECH CORP LTD