Grinding stone for cleaning high-temperature pressure head, cleaning device and cleaning control method

Abstract

The invention provides a grinding stone for cleaning a high-temperature pressure head, a cleaning device and a cleaning control method. The grinding stone and the high-temperature pressure head reciprocate forwards and backwards relatively, so that the to-be-cleaned area of the end surface of the high-temperature pressure head is cleaned. The grinding stone comprises a base part and a plurality of cleaning parts formed on the surface of the base part; the cleaning parts are transversely arranged in a gap manner and form first grooves; the transverse width of any one cleaning part along the end surface is smaller than the width of the end surface; and besides, when the cleaning parts make contact with the to-be-cleaned area of the end surface, the transverse side edges of the end surface are located above the first grooves or outside the grinding stone. With the grinding stone, the cleaning device and the cleaning control method, the end surface of the high-temperature pressure head can be cleaned effectively, the frictional acting force between the grinding stone and the side surface of the high-temperature pressure head can be eliminated, and normal production of products can be guaranteed.

Description

technical field [0001] The invention relates to the technical field of electronic semiconductors, in particular to a grinding stone for cleaning a high-temperature pressure head, a cleaning device and a cleaning control method. Background technique [0002] During the continuous pressing operation of the high-temperature indenter, a layer of gelatinous foreign matter will adhere to its surface. Such as figure 1 As shown, at present, the long or square grindstone 10 is used to rub and clean the end face of the high-temperature indenter 20 at intervals, but it is difficult for the above-mentioned grindstone 10 to concentrate the frictional force on the end face of the high-temperature indenter. The area to be cleaned has poor cleaning effect. Moreover, the surface of the above-mentioned grinding stone 10 after repeated friction and use will form a depression, and when the high-temperature indenter and the grinding stone move together, a lateral friction force will be generat...

AI Technical Summary

Problems solved by technology

like figure 1 As shown, at present, the long or square grindstone 10 is used to rub and clean the end face of the high-temperature indenter 20 at intervals, but it is difficult for the above-mentioned grindstone 10 to concentrate the frictional force on the end face of the high-temperature indenter. area to be cleaned, the cleaning effect is poor

Moreover, the surface of the above-mentioned grinding stone 10 after repeated friction and use will form a depression, and when the high-temperature indenter and the grinding stone move together, a lateral friction force will be generated, which reduces the contact pressure on the end surface of the high-temperature indenter, and it is difficult to remove the more stubborn adhesion. Glue, which in turn makes the cleaning of the high-temperature pressure head incomplete, resulting in abnormal products, and also increases the wear of the high-temperature pressure head

Images