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Mold used for electrode coating and electrode coating device provided with mold

A coating device and mold technology, applied in the direction of rotary printing machine, printing, printing machine, etc., can solve the problems of unfixed samples and lower printing quality, and achieve the effect of improving printing quality, printing efficiency and coating effect

Active Publication Date: 2017-05-10
YANCHENG INST OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In the existing electrode coating device, during the coating process, due to the unfixed sample, the displacement caused by the unfixed sample during the printing process reduces the printing quality

Method used

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  • Mold used for electrode coating and electrode coating device provided with mold
  • Mold used for electrode coating and electrode coating device provided with mold
  • Mold used for electrode coating and electrode coating device provided with mold

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Embodiment Construction

[0027] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments It is a part of embodiments of the present invention, but not all embodiments. The components of the embodiments of the invention generally described and illustrated in the figures herein may be arranged and designed in a variety of different configurations.

[0028] Accordingly, the following detailed description of the embodiments of the invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely represents selected embodiments of the invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art wi...

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Abstract

The invention relates to a mold used for electrode coating and an electrode coating device provided with the mold, and belongs to the field of material coating. The mold comprises a first end face and a second end face opposite to the first end face. The first end face is provided with at least one first groove. The first end face and the second end face are provided with a first connecting part and a second connecting part correspondingly. The two opposite ends of the second end face are provided with third connecting parts correspondingly. Through the mold, samples can be fixed, the coating effect of slurry on the surfaces of the samples is improved, and the printing quality is improved. The electrode coating device comprises the mold, a screen mesh frame and a mold platform. The silk screen frame is provided with screen meshes corresponding to the at least one first groove in a one-to-one mode. The silk screen frame is detachably connected with the first connecting part. The mold platform is detachably connected with the second connecting part. The samples can be fixed by the device, the contact effect of the slurry and the samples during printing is improved, and the printing quality is improved.

Description

technical field [0001] The invention relates to the field of material coating, in particular to a mold for electrode coating and an electrode coating device provided with the mold. Background technique [0002] The coating of electrodeless non-metallic materials mainly includes the coating of inorganic non-metallic ceramics and single crystal materials, the purpose of which is to make such insulating materials conductive under the action of electrode coating, and then meet the necessary conditions for them to be used as electronic products. Ceramics contain many types of ceramics such as dielectric, piezoelectric, ferroelectric, and pyroelectric. In the process of ceramic production, electrode coating is an indispensable and extremely important part. Electrode coating is not only for making the electrodeless non-metallic Surface metallization, which makes the non-conductive ceramic substrate conductive, is also an important basis for its later testing. Among them, the piezo...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B41F15/08B41F15/14B41F15/16B41F15/36
CPCB41F15/08B41F15/14B41F15/16B41F15/36
Inventor 杜建周李运平曹东李娟罗驹华冯青徐一奇
Owner YANCHENG INST OF TECH
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