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Vertical flow guide cooler of computer

A radiator and computer technology, applied in computing, instrumentation, electrical and digital data processing, etc., can solve problems such as airflow overflow and insufficient efficiency

Inactive Publication Date: 2017-05-10
重庆优之唯电子科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] With the development of the economy and the progress of science and technology, the computer has become an indispensable tool for our life and production. Some people spend a long time with the computer every day. However, the computer is a kind of radiation machine, especially the computer case. It is the main radiation source. In order to reduce the radiation of the chassis, the applicant submitted the application number 2016212360708 on November 18, 2016, entitled "A Conduit Type Forced Convection Bottom-Drain Computer Chassis", which can effectively solve the electromagnetic radiation of the computer chassis , the application adopts bottom air inlet and outlet, the inlet air and outlet air are respectively introduced and exhausted through the duct, the air inlet duct points to the components that need heat dissipation, and provides convective air for cooling, but the airflow in the air inlet duct cannot be fully applied to the parts that need to be dissipated. Part, or only applied to a part of a heat dissipation component, and there is a phenomenon of airflow overflow at the same time, and the efficiency of using the imported airflow to dissipate heat is not sufficient, which still needs to be further solved and improved

Method used

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  • Vertical flow guide cooler of computer
  • Vertical flow guide cooler of computer

Examples

Experimental program
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Embodiment Construction

[0011] Examples of the present invention figure 1 , 2 As shown, the computer vertical diversion radiator is provided with a heat sink and an air guide joint, the heat sink is provided with a heat dissipation bottom plate 1, the front of the heat dissipation bottom plate is in contact with the heating components, and the connection method can be screw connection or buckle connection, and the heat dissipation bottom plate Parallel longitudinal side plates 2 are respectively connected to both sides of the back, and a longitudinal wing plate 3 of the same height as the longitudinal side plate is connected between the two longitudinal side plates on the back of the heat dissipation bottom plate, and a bayonet is provided on the upper part of the longitudinal side plate; The joint is provided with a flat runner 4, the upper end of the flat runner is connected with a buffer chamber 5, and the buffer chamber is connected with an air inlet 6, and the inner plate 7 forming the flat runn...

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PUM

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Abstract

The invention discloses a vertical flow guide cooler of a computer. The cooler is characterized by comprising a wind guide connector provided with a flat flow channel; the upper end of the flat flow channel is connected with a buffer cavity; the buffer cavity is connected with an air inlet; an inner side plate forming the flat flow channel covers a longitudinal wing plate and leads to a longitudinal side plate in the width direction; the lower end of the inner side plate is connected with an upper wind guide plate tilting to the interior of the flat flow channel; the lower end of an outer side plate forming the flat flow channel and opposite to the inner side plate bends to the exterior of the flat flow channel in the position of the upper wind guide plate, bends back, bends upwards and is connected with a lower wind guide plate located at the lower part of the upper wind guide plate and parallel to the upper wind guide plate; a wind outlet flow channel is formed between the upper wind guide plate and the lower wind guide plate; a side wall of the buffer cavity extends out of a connecting end plate attached to the outer side of the upper part of the longitudinal side plate; and the connecting end plate is engaged with a bayonet through a hook. According to the cooler, wind flows through cooling fins more intensively, so that the cooling efficiency is higher.

Description

technical field [0001] The invention relates to a heat sink for components inside a computer case, in particular to a vertical flow guide heat sink for a computer. Background technique [0002] With the development of the economy and the progress of science and technology, the computer has become an indispensable tool for our life and production. Some people spend a long time with the computer every day. However, the computer is a kind of radiation machine, especially the computer case. It is the main radiation source. In order to reduce the radiation of the chassis, the applicant submitted the application number 2016212360708 on November 18, 2016, entitled "A Conduit Type Forced Convection Bottom-Drain Computer Chassis", which can effectively solve the electromagnetic radiation of the computer chassis , the application adopts bottom air inlet and outlet, the inlet air and outlet air are respectively introduced and exhausted through the duct, the air inlet duct points to the...

Claims

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Application Information

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IPC IPC(8): G06F1/20
CPCG06F1/20
Inventor 王华生
Owner 重庆优之唯电子科技有限公司
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