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Aluminum chelate-based latent curing agent, method for producing same, and thermosetting epoxy resin composition

A technology of latent curing agent and aluminum chelate compound, which is applied in the field of aluminum chelate latent curing agent, can solve the problem that the storage stability cannot be said to be sufficient, and achieves good storage stability and sensitive thermal response. Effect

Active Publication Date: 2017-05-10
DEXERIALS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, for a one-component thermosetting epoxy resin composition obtained by blending such an aluminum chelate-based latent curing agent with a general-purpose glycidyl ether epoxy resin, at room temperature (20 to 35° C.) Its storage stability is at a level where there is no problem in practical use. However, there is a problem with a one-component thermosetting epoxy resin composition formulated with an alicyclic epoxy resin exhibiting very high cationic polymerizability. Its storage stability at room temperature cannot be said to be a sufficient problem

Method used

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  • Aluminum chelate-based latent curing agent, method for producing same, and thermosetting epoxy resin composition
  • Aluminum chelate-based latent curing agent, method for producing same, and thermosetting epoxy resin composition
  • Aluminum chelate-based latent curing agent, method for producing same, and thermosetting epoxy resin composition

Examples

Experimental program
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Effect test

Embodiment 1

[0097] (Manufacture of aluminum chelate latent curing agent with surface deactivation treatment)

[0098] Dissolve 1.5 parts by mass of methyltrimethoxysilane (KBM-13, Shin-Etsu Chemical Industry Co., Ltd.) in 28.5 parts by mass of cyclohexane to prepare a surface non-activation treatment solution, and put 30 parts by mass of the treatment solution into an untreated surface. 3 parts by mass of the aluminum chelate latent curing agent of comparative example 1 of non-activation treatment, the mixture was stirred at 30° C. and 200 rpm for 20 hours, and the surface of the aluminum chelate latent curing agent was deactivated simultaneously. deal with. After the treatment reaction was completed, the polymer particles were separated from the treatment solution by filtration, and then dried naturally to obtain a spherical aluminum chelate latent curing agent subjected to surface deactivation treatment.

Embodiment 2

[0100] Dissolve 3 parts by mass of methyltrimethoxysilane (KBM-13, Shin-Etsu Chemical Industry Co., Ltd.) in 27 parts by mass of cyclohexane to prepare a surface non-activation treatment solution, and put 30 parts by mass of the treatment solution into an untreated surface. 3 parts by mass of the aluminum chelate latent curing agent of comparative example 1 of non-activation treatment, the mixture was stirred at 30° C. and 200 rpm for 20 hours, and the surface of the aluminum chelate latent curing agent was deactivated simultaneously. deal with. After the treatment reaction was completed, the polymer particles were separated from the treatment solution by filtration, and then dried naturally to obtain a spherical aluminum chelate latent curing agent subjected to surface deactivation treatment.

Embodiment 3

[0102] Use 3 parts by mass of n-propyltrimethoxysilane (KBM-3033, Shin-Etsu Chemical Co., Ltd.) to replace 3 parts by mass of methyltrimethoxysilane (KBM-13, Shin-Etsu Chemical Co., Ltd.). In addition, the same operation as in Example 2 was repeated to obtain a spherical aluminum chelate latent curing agent subjected to surface deactivation treatment.

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Abstract

An aluminum chelate-based latent curing agent for curing a thermosetting epoxy resin, wherein an aluminum chelate-based curing agent interfacially polymerizes a polyfunctional isocyanate compound and, at the same time, is held in a porous resin obtained by radically polymerizing a radical polymerizable compound in the presence of a radical polymerization initiator, the surface of said aluminum chelate-based latent curing agent having been subjected to an inactivation treatment with an alkoxysilane coupling agent. As the alkoxysilane coupling agent, an alkylalkoxysilane is preferred. The radical polymerizable compound preferably comprises a polyfunctional radical polymerizable compound.

Description

technical field [0001] The present invention relates to an aluminum chelate-based latent curing agent, which is an aluminum chelate-based curing agent obtained by holding the aluminum chelate-based curing agent in a porous resin in a curing agent for curing a thermosetting epoxy resin. Compound latent curing agent. Background technique [0002] As a curing agent exhibiting low-temperature rapid curing activity for epoxy resins, it has been proposed to hold an aluminum chelate in porous resin particles obtained by surface-polymerizing a polyfunctional isocyanate compound and simultaneously polymerizing a radically polymerizable compound. An aluminum chelate-based latent curing agent (Patent Document 1). [0003] prior art literature [0004] patent documents [0005] Patent Document 1: Japanese Patent Laid-Open No. 2009-221465 Contents of the invention [0006] The problem to be solved by the invention [0007] However, the aluminum chelate-based curing agent disclosed...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G59/70C08G59/40C08L63/00
CPCC08G59/245C08G59/40C08G59/70C08K5/5415C08L63/00C08G59/4246C08G59/4261C08K9/06C08G59/188
Inventor 神谷和伸
Owner DEXERIALS CORP