Precisely controlled silicon wafer slicing device

Abstract

The invention relates to the technical field of silicon wafer machining equipment, in particular to a precisely controlled silicon wafer slicing device. The precisely controlled silicon wafer slicing device can automatically realize the slicing operation of silicon wafers and ensure cutting precision. The precisely controlled silicon wafer slicing device comprises a base, wherein two transverse guide rails symmetrically arranged in parallel are mounted on the base, a cutting platform is mounted on the transverse guide rails through transverse sliders, and a cutting clamp is mounted on the cutting platform; between the two transverse guide rails, a screw is mounted on the base, the cutting platform is connected with the screw through a screw nut, and the screw is connected with a screw driving motor; at the outer sides of the two transverse guide rails, longitudinal guide rails perpendicular to the transverse guide rails are mounted on the base; a cutting seat is mounted on the longitudinal guide rails through longitudinal sliders, a rotating shaft is mounted on the cutting seat, a cutting wheel is mounted at the end, close to the transverse guide rails, of the rotating shaft, and the cutting seat is connected with a longitudinal driving cylinder; and at one sides of the longitudinal guide rails, scales parallel with the longitudinal guide rails are mounted on the base.

Description

technical field [0001] The invention relates to the technical field of silicon wafer processing equipment, in particular to a device for precisely controlling silicon wafer slicing. Background technique [0002] Since silicon is one of the most abundant elements in the earth's crust, silicon wafers are the most important material in the photovoltaic industry. Microelectronic chips are formed by integrating a large number of transistors on silicon wafers. Silicon wafers are generally cut into pieces by silicon rods, and the existing ones are generally cut manually, with low cutting efficiency and low cutting precision, which cannot guarantee the quality of silicon wafers. Contents of the invention [0003] In order to solve the above problems, the present invention provides a device for precisely controlling silicon wafer slicing, which can automatically realize the slicing operation of silicon wafers and ensure cutting accuracy. [0004] Its technical solution is as follo...

AI Technical Summary

Problems solved by technology

Silicon wafers are generally cut into pieces by silicon rods. The existing ones are generally cut manually. The cutting efficiency is low, and the cutting accuracy is also low, so the quality of silicon wafers cannot be guaranteed.

Images