Aluminum base silicon carbide composite material and preparing method thereof

A technology of aluminum-based silicon carbide and composite materials, which is applied in the field of packaging materials, can solve the problems of insufficient thermal conductivity, manufacturing process and welding performance, and restrict the application of materials, so as to change the difficulty of machining, low production cost, and hot isostatic pressing. The effect of low temperature

Inactive Publication Date: 2017-05-24
江西宝航新材料有限公司
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  • Abstract
  • Description
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  • Application Information

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Problems solved by technology

[0004] The impregnation method used in the existing SiC / Al composite electronic packaging materials has deficiencies in thermal conductivity, manufacturing process and welding performance, and it is difficult to use the existing packaging welding for welding, which greatly restricts the application of this type of material

Method used

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  • Aluminum base silicon carbide composite material and preparing method thereof
  • Aluminum base silicon carbide composite material and preparing method thereof

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Embodiment Construction

[0023] The technical solutions of the present invention will be clearly and completely described below in conjunction with embodiments. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative work shall fall within the protection scope of the present invention.

[0024] In terms of volume fraction, the SiC particles are 40% to 60%, and the balance is aluminum powder. The preparation steps are as follows:

[0025] The aluminum powder and the dried silicon carbide powder are sequentially put into the mixer to mix the powder. Take out a certain amount of mixed powder and put it into a pre-prepared aluminum alloy sheath. Vacuum degassing and hot isostatic pressing are performed on the aluminum alloy sheath containing the mixed powder, and finally the required silicon carbide ...

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Abstract

The invention provides an aluminum base silicon carbide composite material and a preparing method thereof. The material is composed of a base material and a reinforcing material. The base material comprises aluminum powder. The reinforcing material comprises SiC particles and comprises, by mass percent, 40%-60% of the SiC particles and the balance aluminum powder. The provided composite material prepared through a heat isobaric method is good in welding performance and low in production cost, and industrial preparing is easy to achieve. Meanwhile, the operation technology is simple and convenient to conduct, the raw material utilization rate is high, and the prepared material meets the requirements for heat conductivity and the heat expansion coefficient.

Description

Technical field [0001] The invention relates to a packaging material, in particular to an aluminum-based silicon carbide composite material and a preparation method thereof. Background technique [0002] The electronic packaging material is the sealing body of the integrated circuit. It is not only the support of the chip but also the protective body, so that it can avoid the pollution and erosion of moisture, impurities and various chemical atmospheres in the atmosphere, so that the integrated circuit chip can perform stably Normal electrical functions, so packaging materials play a decisive role in the thermal performance and reliability of electronic devices and circuits. Now, the electronic packaging materials industry has become an important branch of the semiconductor industry involving many disciplines such as chemistry, electricity, thermodynamics, machinery, and process equipment. [0003] SiC particles as the reinforcement of metal matrix composites have the advantages o...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C22C21/00C22C29/06C22C32/00B22F3/15
CPCB22F3/1216B22F3/15B22F2003/153C22C21/00C22C29/065C22C32/0063
Inventor 李振民刘干孟庆宇
Owner 江西宝航新材料有限公司
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