A kind of igbt module testing device

Abstract

The invention discloses an IGBT module testing device, which comprises a testing tool comprising probes and having a fixed position, and a hot plate used for fixing an IGBT module, wherein the hot plate can drive the IGBT module to move in the direction of the testing tool, so as to realize contact of needle-shaped terminals of the IGBT and the probes; and conductive sheets are arranged between the needle-shaped terminals and the probes, and each conductive sheet comprises an inclined end which is to be in contact with the corresponding needle-shaped terminal and a horizontal end which is to be in contact with the corresponding probe. The IGBT module testing device improves the stability of tests, eliminates the mechanical damage caused by the needle-shaped terminals of the IGBT module during the test process, and prolongs the service life.

Description

technical field [0001] The invention relates to the field of testing devices, in particular to an IGBT module testing device. Background technique [0002] In the IGBT module process flow, in order to evaluate the electrical parameter characteristics of the module, it is necessary to test the packaged IGBT module. Generally speaking, the internal interconnection circuit of the IGBT module is drawn out through the busbar terminal to provide a port for testing and connecting with the external circuit. [0003] In the prior art, for IGBT modules with needle terminals, due to the small size and narrow spacing of the needle terminals, spring probes with large contact areas cannot be used to test the module, and the probes are in contact with the pins. During the contact process of the shape terminal, due to factors such as positioning deviation of the IGBT module and contact slippage, it is easy to cause poor contact and affect the test of the IGBT module. Failure to ensure tha...

AI Technical Summary

Problems solved by technology

[0003] In the prior art, for IGBT modules with needle terminals, due to the small size and narrow spacing of the needle terminals, spring probes with large contact areas cannot be used to test the module, and the probes are in contact with the pins. During the contact process of the shape terminal, due to factors such as positioning deviation of the IGBT module and contact slippage, it is easy to cause poor contact and affect the test of the IGBT module

It is impossible to ensure that the pin terminals are aligned with the spring probes, which may easily lead to poor contact between the probes and the module pin terminals, thereby affecting the IGBT module test

During the movement, due to the possibility of slipping during contact, under the action of this stress, the pin terminals of the module may be deformed or even broken, making the module unusable

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