A 360° Rotation Adsorption Displacement Fitting Device

Abstract

The invention discloses an adsorptive shift lamination device allowing 360-degree rotation. The device comprises a base, a first lamination moving arm, a second lamination moving arm, a first X-axis driving mechanism, a second X-axis driving mechanism, a YZ-axis driving mechanism, a first adsorptive lamination seat, a second adsorptive lamination seat, a first rotating mechanism and a second rotating mechanism, wherein the first lamination moving arm and the second lamination moving arm are mounted at the lower end of the base, the first X-axis driving mechanism and the second X-axis driving mechanism are arranged in the base and used for driving the first lamination moving arm and the second lamination moving arm to move in the X-axis direction, the YZ-axis driving mechanism is mounted above the base and used for driving the base to move in the Y-axis and Z-axis directions, the first and second adsorptive lamination seats are arranged on the inner side surfaces of the first lamination moving arm and the second lamination moving arm respectively and used for extending into a product, and the first and second rotating mechanisms are used for driving the first and second adsorptive lamination seats to rotate; a plurality of first and second vacuum adsorption holes are formed in the outer surfaces of the first and second adsorptive lamination seats respectively. By means of the device, 360-degree lamination can be performed on the inner wall of the product to meet different lamination requirements and improve the market competitiveness. The device is compact in structure and good in balancing performance and is very high in work efficiency and quality through automatic lamination.

Description

Technical field: [0001] The invention relates to the field of lamination technology, in particular to a 360° rotation adsorption displacement lamination device. Background technique: [0002] Bonding technology is a technology often used in modern industrial production, however, plane bonding technology is only applicable to the bonding of flat plates. [0003] With the development of the industry, some products need to attach various software sheets such as PC and EVA to the inner wall of the product, but the planar bonding technology in the prior art cannot realize the attachment of various software sheets such as PC and EVA to the inner wall of the product , and carry out multi-angle lamination, so that the producer can only laminate manually, which is labor-intensive, especially for smaller products, it is difficult to laminate, and it is difficult to guarantee the lamination quality, and the work efficiency It is not conducive to improving market competitiveness. [0...

AI Technical Summary

Problems solved by technology

[0002] Bonding technology is a technology often used in modern industrial production, however, plane bonding technology is only applicable to the bonding of flat plates

[0003] With the development of the industry, some products need to attach various software sheets such as PC and EVA to the inner wall of the product, but the planar bonding technology in the prior art cannot realize the attachment of various software sheets such as PC and EVA to the inner wall of the product , and carry out multi-angle lamination, so that the producer can only laminate manually, which is labor-intensive, especially for smaller products, it is difficult to laminate, and it is difficult to guarantee the lamination quality, and the work efficiency Low, not conducive to improving market competitiveness

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