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Multi-station automatic detection integrated equipment

An automatic detection and multi-station technology, applied in the field of electrical detection, can solve the problems of low efficiency, time-consuming and labor-intensive, etc., and achieve the effect of preventing hidden accidents, improving detection efficiency, and avoiding messy gas pipelines

Inactive Publication Date: 2017-05-31
OHNISHI ELECTRONICS (KUNSHAN) CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the existing technology, the comprehensive testing of flexible circuit substrates requires the use of multiple testing equipment for testing according to the testing process. The single-shot pressing fixture needs to be tested by multiple fixtures, and it needs to transfer loading and unloading, which is inefficient. , and time-consuming

Method used

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  • Multi-station automatic detection integrated equipment

Examples

Experimental program
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Effect test

Embodiment

[0033] Please refer to Figure 1-Figure 8 , the present embodiment is a multi-station automatic detection integrated equipment 100, which includes a cabinet 1, a rotary conveying module 2 fixed on the cabinet 1, a number of lower handles fixed on the rotary conveying module 2 and rotating with it. The tool device 3, the loading station 7, the first inspection station 8, the second inspection station 9 and the unloading station 10 arranged around the rotary conveying module 2. On the cabinet 1, a first pressing detection device 4 is fixed above the first detection station 8, a second pressing detection device 5 is fixed above the second detection station 9, and a CCD position acquisition device 6. On the cabinet 1, a blanking module 11 is arranged beside the blanking station 10, and a blanking conveying module 12 is arranged beside the blanking module 11.

[0034] The rotary conveying module 2 is a quarter-disk structure, which includes a first mounting surface 21, a second m...

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Abstract

The invention discloses multi-station automatic detection integrated equipment which comprises a cabinet, a rotary conveying module, a plurality of lower jig devices, a feeding station, a first detection station, a second detection station and a discharging station. The rotary conveying module is fixed onto the cabinet, the lower jig devices are fixed onto the rotary conveying module and can carry out rotational movement along with the rotary conveying module, the feeding station, the first detection station, the second detection station and the discharging station are arranged around the rotary conveying module, a first press-fit detection device, a second press-fit detection device and a CCD (charge coupled device) location acquisition device are fixed onto the cabinet, the first press-fit detection device is positioned above the first detection station, the second press-fit detection device is positioned above the section detection station, and the CCD location acquisition device is positioned above the feeding station. The multi-station automatic detection integrated equipment has the advantages that the multi-station automatic detection integrated equipment is of a four-station structure, all tests on circuit boards are integrated on the two detection stations, and accordingly the detection efficiency can be greatly improved.

Description

[0001] 【Technical field】 [0002] The invention belongs to the technical field of electrical detection, in particular to a multi-station automatic detection integrated equipment. [0003] 【Background technique】 [0004] With the rapid development of information products such as mobile phones, PADs, and smart instruments, the thickness requirements of products are becoming lighter and lighter, and the weight requirements are becoming lighter and lighter. smaller. According to the needs of market customers, the pitch of the gold fingers on FPC products is only 0.14mm, and the gap between the gold fingers is only 0.07mm. If the linear probe is directly used for testing, the product will be crushed, so the transfer substrate can only be used as an intermediate connection bridge, that is, the gold finger of the line is bonded to the gold finger. Circuit boards (including flexible circuit boards) need to undergo a series of tests such as frequency test, MIC verification, CAM, etc. ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01R31/28
CPCG01R31/2834
Inventor 章维
Owner OHNISHI ELECTRONICS (KUNSHAN) CO LTD
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