Design method of on-chip high-low temperature S parameter TRL calibration piece

Abstract

The invention discloses a design method of an on-chip high-low temperature S parameter TRL calibration piece, and relate to the technical field of methods for measuring electric variables or magnetic variables. The method comprises following steps of (1) design of on-chip S parameter calibration pieces: for different calibration temperature, designing on-chip S parameter calibration pieces at different temperatures, wherein the on-chip S parameter calibration pieces adopt coplanar waveguide transmission line structures and TRL forms, and comprise a direct standard piece T, a reflection standard piece R and a transmission line standard piece L; and (2) design of an on-chip terminal resistor. According to the invention, design and manufacturing of the on-chip high-low temperature S parameter calibration piece are finished; representation of the on-chip standard pieces at different temperatures is finished; effective calibration of an on-chip high-low temperature S parameter test system at different temperatures is achieved; accurate and consistent on-chip high-low temperature S parameter measurement results are ensured; and the method is simple to operate and high in calibration precision.

Description

technical field [0001] The invention relates to the technical field of methods for measuring electric variables or magnetic variables, in particular to a design method of an on-chip high and low temperature S-parameter TRL calibration piece. Background technique [0002] In recent years, the development of on-chip high and low temperature testing equipment has reduced the cost of on-chip high and low temperature S-parameter measurement and improved the measurement speed of on-chip high and low temperature S-parameters. These advantages make it possible to model the complex thermal effects and analyze the working process of microwave power devices, and promote the development of microwave monolithic circuits used in complex environments. [0003] For on-chip high and low temperature S-parameter measurement, American CASCADE Company cooperated with TEMPTRONIC and ESPEC to design an on-chip high and low temperature S-parameter test system, the structure is as follows figure 1 ...

AI Technical Summary

Problems solved by technology

Off wafer calibration parts are suitable for the tested parts made on various substrates. The manufacturing process is difficult, but due to the neglect of the influence of the substrate material, transmission line size, and probe tip transition between the calibration part and the tested part, the calibration accuracy Not high enough, mainly used in general industrial measurement

Images