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Circuit card assembly with thermal energy removal

A circuit card assembly and thermal plug-in technology, which is applied in the direction of circuits, electrical components, electric solid devices, etc., can solve the problems of ineffective heat transfer and inability to use high-performance circuit boards, etc.

Inactive Publication Date: 2017-05-31
GE INTELLIGENT PLATFORMS LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, it may not be possible to use a high-performance board due to the inability to transfer heat efficiently

Method used

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  • Circuit card assembly with thermal energy removal
  • Circuit card assembly with thermal energy removal
  • Circuit card assembly with thermal energy removal

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0049] The methods described in this specification provide an improved circuit card assembly having a locking arrangement (eg, locking wedge method) combined with a thermal insert to increase heat dissipation. This improves heat dissipation efficiency while maintaining traditional size constraints.

[0050] In other aspects, the tolerance between the circuit card and the thermal plug is reduced after the locking mechanism is secured to the chassis. The thermal connection between the thermal insert and heat sink is increased, creating an additional thermal path that extends through the thermal insert to the wedge used in the locking mechanism, further reducing the overall thermal resistance of the system.

[0051] By maintaining existing size standards, the method can be implemented in existing constructions without requiring changes to the circuit card assembly chassis. Therefore, the overall layout of the current system will not be disturbed. Additionally, the speed of the ...

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PUM

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Abstract

A circuit card assembly includes a heat sink, a locking mechanism, and a thermal insert. The heat sink couples to a circuit board and has an upper surface and a lower surface. The heat sink has a channel extending downwards along the upper surface thereof. The locking mechanism is disposed within the channel and includes a plurality of solid wedges movably arranged within the channel. Movement of the wedges is effective to secure the circuit card assembly to a holder. The thermal insert is disposed within the heat sink and is an elongated member. The thermal insert is configured to contact a portion of at least one of the solid wedges, thus assisting in removing a first amount of thermal energy from the circuit board.

Description

[0001] field of invention [0002] The present invention relates to a circuit card assembly and, more particularly, to removing thermal energy associated with or coupled to the circuit card assembly from the circuit card assembly. Background technique [0003] Circuit card assemblies are used for a variety of purposes in existing electronic systems. The circuit card assembly may include a microprocessor (or other integrated circuit), or passive components such as resistors, capacitors or inductors. These circuit card assemblies are typically arranged in a chassis. During operation of circuit card assemblies, the electrical components disposed on these cards generate heat. Even if the components are not damaged by the heat, the operation of the circuit card may be inefficient due to the heat. If this heat is not removed, damage to the circuit card assembly or other devices in the vicinity of the circuit card may occur. [0004] The current card assembly is held in place in ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/14H05K7/20
CPCH05K7/1404H05K7/20545H01L2924/0002H05K7/20509H01L2924/00H05K7/20309H05K7/20336
Inventor G.C.柯克S.S.乔罕S.康诺利Z.J.侯赛因
Owner GE INTELLIGENT PLATFORMS LTD