Scanning Exposure Method of Ultra-Large Board Direct Write Lithography Machine
A technology of scanning exposure and lithography machine, applied in the field of direct writing exposure, can solve the problems of equipment utilization rate and applicability discount, increase equipment use cost and manpower, and fail to reach the production capacity of ordinary board LDI, so as to improve utilization rate. and applicability, the effect of preventing the production line width from exceeding the standard
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Embodiment 1
[0034] Example 1: Scanning Exposure Method for Ultra-Large Plate Direct Write Lithography Machine
[0035] Such as figure 1 As shown, it is a schematic diagram of the layout structure of the optical path of the present invention relative to the ultra-large substrate. The number of light paths in the schematic diagram may vary according to different equipment requirements. In this example, four light paths are used for illustration. The layout of the four optical paths only covers half the area of the ultra-large substrate. The spacing between the optical paths is arranged according to the width that each optical path can scan and the number of strips that need to be scanned. In this example, it is necessary to complete the scanning of half a super-large board and illustrate it according to the width of three stripes.
[0036] Such as figure 2 Shown is a schematic diagram of starting to scan the first band. During the scanning process, the substrate moves at a constant ...
Embodiment 2
[0043] Example 2: Scanning Exposure Method for Ultra-Large Plate Direct Write Lithography Machine
[0044] The optical path full-board coverage technology adopted in the existing ultra-large board LDI equipment only needs to move the width of one strip in each step direction, the moving distance is very small, and large strips will not be caused by platform positioning accuracy, orthogonality, etc. With the problem of splicing and misalignment, it meets the production requirements of the PCB process, and the general requirement is that the index is ±10% of the minimum production line width of the equipment.
[0045] However, the method of using the optical path of the present invention to cover half of the entire board area (such as embodiment 1) to complete the production of super large boards requires a large step, and the step distance is half the width of the super large board. The optical path advances half the width of the substrate along the stepping direction, and scan...
Embodiment 3
[0048] Example 3: Direct-write lithography equipment and scanning exposure method thereof
[0049] The direct writing lithography machine includes a suction cup and a plurality of optical path components; the relative positions of the optical path components are fixed; the multiple optical path components are optical path components covering 1 / n suction cups, and n is greater than 1.
[0050] The following scanning exposure methods are used:
[0051] When the width of the substrate to be exposed is less than or equal to 1 / n of the width of the chuck, the exposure is completed after reciprocating scanning of multiple strips during scanning exposure; when the width of the substrate to be exposed is greater than 1 / n of the width of the chuck, the scanning exposure When scanning multiple strips back and forth, the width of the exposure is 1 / n of the width of the suction cup, and then the optical path or the suction cup makes a large step in the X-axis direction, and then scans mul...
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Abstract
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