Gallium alloy heat dissipation material provided with fiber framework and production technology thereof

Abstract

The invention relates to the technical field of machinery, in particular to a gallium alloy heat dissipation material and a production technology thereof. The gallium alloy heat dissipation material provided with a fiber framework comprises a carbon fiber mesh; the thickness of the carbon fiber mesh is 0.1-5 mm; the diameter difference of openings in two sides of mesh openings of the carbon fiber mesh is less than 0.2mm, and each of the diameters of the openings in two sides is 0.1-5 mm; the mesh openings are through holes with the front and back communicated; the internal diameter of each through hole is more than 1.5 times greater than the diameter of the opening in the front side; and gallium alloy is embedded in the mesh openings of the carbon fiber mesh. When gallium alloy is in the liquid state, the surface tension is extremely high, and a smaller diameter of each of the openings of the mesh openings and a larger internal diameter of each through hole are arranged, so that gallium alloy is excellently fixed in the carbon fiber mesh and can in direct contact with the external part without flowing out. Heat dissipation is realized through internal convection caused by temperature difference of liquid-state metal. Compared with solid metal, the liquid-state gallium alloy has remarkably improved heat dissipation property and is suitable for being used as heat dissipation material.

Description

technical field [0001] The invention relates to the field of mechanical technology, and relates to a gallium alloy heat dissipation material and a production process thereof. Background technique [0002] The existing heat dissipation materials for electronic products generally use metal heat sinks made of metal. However, for some electronic products with high heat during operation, the heat dissipation effect of the original heat sink is not good; [0003] Or, auxiliary facilities such as fans and water cooling systems need to be added for heat dissipation, and maintenance and replacement are required, which greatly increases the cost of heat dissipation; [0004] Due to its low melting point, gallium alloy can be called a kind of "liquid metal" and has good heat dissipation ability. However, although it has fluidity, it lacks restraint, and the fluidity is too strong, which is easy to cause potential short circuit to the circuit of electronic products. threaten. Content...

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Problems solved by technology

[0002] The existing heat dissipation materials for electronic products generally use metal heat sinks made of metal. However, for some electronic products with high heat during operation, the heat dissipation effect of the original heat sink is not good;

[0003] Or, auxiliary facilities such as fans and water cooling systems need to be added for heat dissipation, and maintenance and replacement are required, which greatly increases the cost of heat dissipation;

[0004] Due to its low melting point, gallium alloy can be called a kind of "liquid metal" and has good heat dissipation ability. However, although it has fluidity, it lacks restraint, and its fluidity is too strong, which is easy to cause potential short circuit to the circuit of electronic products. threaten

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