Relief grid representation and 3D printing slicing method and system based on bump map
A 3D printing and grid technology, applied in the field of 3D printing slicing, can solve the problems of large memory occupation, large file space, and unsmooth page running.
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[0051] refer to Figure 1 to Figure 6 , a kind of embossed grid representation and 3D printing slicing method based on bump map that the present invention proposes, comprises the following steps:
[0052] Step S1, obtaining a three-dimensional basic grid model, and performing adaptive midpoint subdivision processing on the triangles intersecting the Z plane in the three-dimensional basic grid model according to the topological rules of the grid;
[0053] In this step, judge whether the triangle in the three-dimensional basic mesh model intersects with the Z plane by an intersection test algorithm, wherein the intersection test algorithm includes:
[0054] Obtain the triangle q in the 3D basic mesh model;
[0055] Calculate the bounding box of the triangle q, wherein the bounding box Z-axis minimum value is zmin, and the bounding box Z-axis maximum value is zmax;
[0056] Calculating tmin and tmax, and judging whether tmin is less than tmax, when the judgment result is yes, t...
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