Eutectic soldering chip tooling system for ceramic packaging
A technology of ceramic packaging and tooling and fixtures, which is applied in the manufacture of electrical components, circuits, semiconductors/solid-state devices, etc., can solve the problems of heating plate conduction and inability to eutectic welding, etc., and achieve the effect of easy automation, large batches and high reliability
Active Publication Date: 2019-04-12
WUXI ZHONGWEI GAOKE ELECTRONICS
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Problems solved by technology
For the ceramic housing of semiconductor packaging, the packaging form, structure and size of different housings have different requirements for equipment and tooling, such as ordinary spherical array ceramic housings (CBGA), quadrilateral flat ceramic housings (CQFP), surrounded by The ceramic base surface of the lead ceramic case (CLCC) can fully contact the heating substrate of the eutectic welding equipment, and the heating plate can heat and cool the case to realize the welding process of the eutectic welding process; and for the J-shaped lead small size ceramic case ( CSOJ), the ground ceramic substrate of the dual in-line ceramic package (CDIP) cannot be fully contacted with the heating plate. During the eutectic welding process, the heat of the heating plate cannot be effectively conducted with the ceramic substrate, resulting in failure eutectic soldering
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Embodiment Construction
[0023] The present invention will be further described below in conjunction with specific drawings.
[0024] like figure 1 As shown, the eutectic welding chip tooling system for ceramic packaging of the present invention includes a eutectic welding atmosphere protection device 1 and an atmosphere protection cover 2. The eutectic welding atmosphere protection device 1 is fixed on the pulse heating table, and the atmosphere protection The cover 2 is installed directly above the eutectic welding atmosphere protection device 1, and the atmosphere protection cover 1 and the eutectic welding atmosphere protection device 1 realize sealing fit through rotation; the first protective atmosphere is reserved on the eutectic welding atmosphere protection device 1 Port 11, second protective atmosphere port 12, third protective atmosphere port 21, fourth protective atmosphere port 22, fifth protective atmosphere port 31, sixth protective atmosphere port 32, seventh protective atmosphere port...
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The invention relates to a eutectic welding piece tool jig system for ceramic package. The eutectic welding piece tool jig system is characterized by comprising a eutectic welding atmosphere protection device and an atmosphere protection cover, wherein the eutectic welding atmosphere protection device is fixed on a pulse heating table, the atmosphere protection cover is arranged right above the eutectic welding atmosphere protection device, the atmosphere protection cover and the eutectic welding atmosphere protection device are hermetically matched by rotation, a plurality of protection atmosphere inlets and vacuum holes are reserved in the eutectic welding atmosphere protection device, the vacuum holes are corresponding to vacuum holes reserved in the pulse heating plate, a thermal conduction substrate is attached at positions of the vacuum holes by vacuum, and a ceramic shell is arranged on the thermal conduction substrate. The eutectic welding piece is simple in structure and is convenient to operate, and automatic production of eutectic welding pieces on a large scale can be achieved.
Description
technical field [0001] The invention relates to a eutectic soldering chip tooling and fixture system for ceramic packaging, in particular to a tooling and fixture system required for automatic production of a chip for eutectic soldering and mounting on a dual-in-line ceramic shell. The invention belongs to the technical field of semiconductor package manufacturing. Background technique [0002] In the process of semiconductor packaging, as the size of the device is getting smaller and the power is getting bigger and bigger, the heat dissipation requirements of the chip are getting higher and higher. The traditional conductive adhesive has a lower thermal conductivity and is replaced by metal eutectic solder. High thermal conductivity and good bonding reliability, but the eutectic welding process is more complicated to implement than the adhesive bonding process, and the speed of mass production is slow and the efficiency is low. [0003] The development of semiconductor equ...
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IPC IPC(8): H01L21/56H01L21/67
CPCH01L21/561H01L21/67121
Inventor 李良海丁雪龙
Owner WUXI ZHONGWEI GAOKE ELECTRONICS