Power module integrated with water-cooled radiator

Abstract

A power module integrated with a water-cooled radiator, including a heat-dissipating substrate integrated with a water-cooled radiator, through reflow soldering to an insulating substrate DBC of the heat-dissipating substrate, and a chip welded to the insulating substrate DBC to realize the electrical connection between the chip and the copper layer on the surface of the insulating substrate DBC The aluminum wire, the silicone gel protecting the chip and the aluminum wire, and the plastic shell covering the power terminal are characterized in that the front of the heat dissipation substrate is bonded to the insulating substrate DBC, the back of the heat dissipation substrate is a water-cooled radiator, and the bottom of the heat dissipation substrate There are at least two water inlets and outlets connected to the external water circulation to form the overall heat dissipation system of the module; the positions of the at least two water inlets and outlets are set on the short side or the long side of the heat dissipation substrate, and the number of the water inlets and outlets is between 2 and 10 Among them; the present invention directly integrates the water cooling system on the heat dissipation substrate, effectively avoiding the problem of water leakage and failure caused by the flatness of the module and poor sealing with the radiator.

Description

technical field [0001] The invention relates to a high-reliability power module integrated with a water-cooled radiator, which belongs to the technical field of power electronics design, manufacture and application. Background technique [0002] The traditional power module is installed on the water-cooled radiator by means of sealing ring to dissipate heat. However, in actual application, due to the difference in the flatness of the bottom surface of the module and the poor cooperation between multiple components, the water-cooled radiator leaks. As a result, the power module fails. The water-cooled radiator is directly integrated under the original heat dissipation substrate, which eliminates the problem of poor sealing of the current heat dissipation system and improves the reliability of the module application. Contents of the invention [0003] The purpose of the present invention is to overcome the deficiencies of the existing technology, and provide a reasonable st...

AI Technical Summary

Problems solved by technology

[0002] The traditional power module is installed on the water-cooled radiator by means of sealing ring to dissipate heat. However, in actual application, due to the difference in flatness of the bottom surface of the module and poor cooperation between multiple components, the water-cooled radiator leaks. resulting in failure of the power module

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