A kind of wet etching equipment and wet etching method

Abstract

The invention discloses wet etching equipment and wet etching method, wherein the wet etching equipment includes an etching cavity which is internally provided with a movable rotatable working table and a spray head device arranged above the working table; the working table is used for bearing a substrate to be etched which includes thin film layers that covers the substrate; and the spray head device is used for spraying etching liquid to the thin film layer corresponding to each pixel of a pattern to be formed one by one. According to the wet etching equipment, the spray head device is utilized to spray etching liquid to the thin film layer corresponding to each pixel of the pattern to be formed, thereby realizing separate etching of each pixel, the usage amount of etching liquid is reduced, the etching efficiency is improved, and etching of multiple layers of thin films can be conveniently realized.

Description

Technical field [0001] The invention relates to the field of display device preparation, and in particular to a wet etching equipment and a wet etching method. Background technique [0002] Wet etching uses an appropriate etching solution to chemically react with the etched object to change the structure of the etched object, so that the part of the film not covered by the photoresist is separated from the substrate surface, while the area covered by the photoresist is preserved. down, so that the required pattern is obtained on the surface of the substrate. Existing wet etching equipment uses acidic liquid to etch the substrate in a wet etching tank. [0003] In the thin film etching process using existing wet etching equipment, since the etching liquid is sprayed onto the entire substrate or immersed in the substrate to etch the substrate, not only does the entire process require a relatively large amount of etching liquid, but Moreover, since the etching solution in the...

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Problems solved by technology

[0003] In the thin film etching process using the existing wet etching equipment, since the etching solution is sprayed onto the entire substrate or soaked in the substrate to etch the substrate, not only the amount of etching solution required in the whole process is relatively large, but also Moreover, since the etching solution in the wet etching tank is used repeatedly, the etching efficiency will continue to decline, resulting in long etching time and low etching efficiency.

[0004] In addition, with the continuous advancement of technology, the film to be etched is no longer just a single-layer film, but often multi-layered. The etching selection ratio of different films will be different. Existing wet etching equipment performs multiple When etching one layer, it is necessary to etch one layer before etching the next layer, which makes the existing wet etching equipment inconvenient for multi-layer etching

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