Car roof solar energy chip integration device , solar energy automobile and method for packaging chip

Abstract

The invention provides a car roof solar energy chip integration device, solar energy automobile and method for packaging a chip. The integration device includes a substrate in which through holes are arranged, the front side being provided with a first trench, and the reverse side being provided with a second trench; solar energy chips fixed on the front side of the substrate; a plurality of conductive bands arranged in the first trench, the first end of each conductive band being connected with the solar energy chip, and the second end being led out from the through hole to the reverse side of the substrate; and bypass diodes and anti-reversion diodes arranged in the second trench and connected with the second ends of the conductive bands. According to the car roof solar energy chip integration device, solar energy automobile and method for packaging the chip provided by the invention, the trenches and through holes are arranged in the substrate for arrangement of the bypass diodes, anti-reversion diodes and conductive bands, the problem in the prior art that electrical wiring control is not precise is solved, the light incoming amount of the solar energy chips is improved, the technology is simplified, and the electrical wiring precision is improved.

Description

technical field [0001] The invention relates to solar cell technology, in particular to a roof solar chip integration device, a solar car and a chip packaging method. Background technique [0002] Solar chips are an important part of solar cars, used to convert light energy into electricity to power the car. [0003] In order to protect the solar chip from damage, the solar chip in the prior art will be packaged. At present, most of the solar chip packaging process is to cover the solar chip with protective materials, such as glass, acrylic, PC or plastic film, etc. , these encapsulation methods have the following defects: [0004] 1. After integrating the solar chip system, the weight of the roof increases a lot, which is not conducive to the lightweight design of the vehicle; [0005] 2. The integrated operation and construction of the electrical system of the solar chip are difficult; [0006] 3. It is difficult to control the position accuracy of solar chip integratio...

AI Technical Summary

Problems solved by technology

[0004] 1. After integrating the solar chip system, the weight of the roof increases a lot, which is not conducive to the lightweight design of the vehicle;

[0005] 2. The integrated operation and construction of the electrical system of the solar chip are difficult;

[0006] 3. It is difficult to control the position accuracy of solar chip integration related diodes, conductive strips, and electrical wiring harnesses, and it is difficult to construct;

[0007] 4. The light transmittance of the packaging material itself is limited, resulting in a decrease in the packaging efficiency of solar chips;

[0008] 5. There is a gap between these packaging materials and the chip, which causes external factors such as water vapor, air, and thermal expansion to affect the chip packaging effect, and has extremely high requirements for the sealing of the packaging process

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