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Inductive structure

A technology of inductance and bending, which is applied in the direction of electrical component structure association, transformer/inductor coil/winding/connection, etc., can solve the factors that are easy to generate coupling, spiral inductance or eight-shaped inductance to limit the chip area, and affect the quality of the inductance And other issues

Active Publication Date: 2019-10-22
REALTEK SEMICON CORP
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Problems solved by technology

[0002] In advanced technology, the design of spiral inductors or figure-eight inductors is often limited by chip area, and the cost of spiral inductors or figure-eight inductors is relatively high
In addition, the distance between the inductor and the substrate is relatively close, and coupling between the two is easy to occur, which seriously affects the quality factor of the inductor.

Method used

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Embodiment Construction

[0055] As used in the present invention, "coupling" may mean that two or more elements are in direct physical or electrical contact with each other, or are in indirect physical or electrical contact with each other.

[0056] figure 1 It is a schematic diagram illustrating an inductor structure according to an embodiment of the present invention. As shown in the figure, the inductor structure 100 includes a first bent metal part 110 , a second bent metal part 120 and a connection part 130 . The first curved metal portion 110 is disposed on a layer (not shown in the figure), the layer is located on a first plane (eg, XY plane), and the layer may be a CMOS oxide layer or a similar structure. The first curved metal portion 110 is located on a second plane (such as the XZ plane), and the first plane is perpendicular to the second plane. The second curved metal part 120 is disposed on the layer, and the second curved metal part is located on the second plane. The connection part ...

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Abstract

The invention provides an inductance structure. The Inductance structure comprises a first bent metal portion, a second bent metal portion and a connecting portion. The first bent metal portion is disposed on a layered material, wherein the layered material is located on a first plane. The first bent metal portion is located on a second plane, and the first plane is perpendicular to the second plane. The second bent metal portion is disposed on the layered material, and the second bent metal portion is located on the second plane. The connecting portion is connected to the first bent metal portion and the second bent metal portion in a coupling mode. According to the inductance structure of the embodiment of the invention, the problems that the design of spiral inductance or splayed inductance is often limited by the chip area and the cost is high are improved; and the problem that the inductance quality is seriously affected by the coupling phenomenon resulted from the close distance between the inductance and the substrate is also improved.

Description

technical field [0001] The present invention relates to a basic electronic circuit, and in particular to an inductive structure. Background technique [0002] In advanced technology, the design of spiral inductors or figure-of-eight inductors is often limited by the chip area, and the cost of spiral inductors or figure-of-eight inductors is relatively high. In addition, the distance between the above-mentioned inductor and the substrate is relatively close, and coupling between the two is easy to occur, which seriously affects the quality factor of the inductor. Contents of the invention [0003] To solve the above problems, a technical solution of the present invention relates to an inductor structure, which includes a first bent metal part, a second bent metal part and a connecting part. The first curved metal part is configured on the layer, and the layer is located on the first plane. The first curved metal part is located on the second plane, and the first plane is ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01F27/28H01F27/40
Inventor 颜孝璁蔡志育黄凯易
Owner REALTEK SEMICON CORP
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