Flow guiding and heat dissipation device

A technology of air diversion heat dissipation and air diversion device, which is applied in the direction of cooling/ventilation/heating transformation, electrical components, electrical equipment structural parts, etc., and can solve problems such as intricate air ducts, increased failure rates, and affecting air intake of upper-level equipment. To achieve the effect of solving heat accumulation, ensuring effective operation and effective heat dissipation

Active Publication Date: 2017-07-04
GUANGDONG VTRON TECH CO LTD
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Problems solved by technology

[0003] When processor devices with different air duct forms are placed in the cabinet for combined application, the air ducts are intricate, and the air outlet from the lower equipment often affects the air intake from the upper equipment (such as figure 2 shown in ① and ②), which will worsen the air intake environment of the upper equipment
The higher the temperature of the air inlet environment, the serious impact on the reliability of the business chips and power devices on the equipment boards. Research shows that the failure rate will increase by 10% when the chip junction temperature rises by 1 degree

Method used

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Embodiment Construction

[0024] An embodiment of the present invention provides a flow guide and heat dissipation device, which solves the technical problem of heat accumulation between devices in a cabinet.

[0025] In order to make the purpose, features and advantages of the present invention more obvious and understandable, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the following The described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0026] see figure 1 , an embodiment of a conduction heat dissipation device provided in an embodiment of the present invention includes:

[0027] Such a...

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Abstract

The embodiment of the invention discloses a flow guiding and heat dissipation device. A technical problem of heat accumulation between devices in a cabinet is solved. The flow guiding and heat dissipation device comprise an air charging flow guiding device, an air discharging flow guiding device and a fan module. The air charging flow guiding device and the air discharging flow guiding device are installed on a square hole strip of the cabinet through lugs. The devices are installed on the square hole strip of the cabinet through a lug. The fan module is installed on the top of the cabinet.

Description

technical field [0001] The invention relates to the field of heat dissipation, in particular to a flow guiding heat dissipation device. Background technique [0002] At present, processor equipment is widely used in the visualization industry, and its main function is the input, conversion processing and output of images and video signals. Due to the diversification of customer needs and application scenarios, the form of processor equipment is also diversified, and the air ducts at the thermal design level are also diversified, such as: upper and lower air ducts, left and right air ducts, front and rear air ducts, etc. [0003] When processor devices with different air duct forms are placed in the cabinet for combined application, the air ducts are intricate, and the air outlet from the lower equipment often affects the air intake from the upper equipment (such as figure 2 ① and ② in the middle), and then worsen the air intake environment of the upper equipment. The highe...

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20
CPCH05K7/20145H05K7/20172
Inventor 孙盼盼
Owner GUANGDONG VTRON TECH CO LTD
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