Lower electrode assembly for plasma processing equipment and plasma processing equipment

Abstract

According to a lower electrode assembly for plasma processing equipment and the plasma processing equipment, for the phenomenon that electrostatic charges in a cooling pipeline are accumulated to generate discharge to damage the lower electrode assembly, the structure of the cooling pipeline is improved, the cooling pipeline is distinguished inside and outside a radio frequency field, the cooling pipeline in the radio frequency field environment is made of a non-metal material, and the cooling pipeline in the non-radio frequency field environment has a low-resistance conductive characteristic. The problem of electrostatic charge accumulation caused by an existing high-resistance cooling pipeline is solved, and electrical damage or other risks caused by electrostatic charge accumulation are greatly reduced.

Description

technical field [0001] The invention relates to the technical field of semiconductor equipment, in particular to a lower electrode assembly for plasma processing equipment and the plasma processing equipment. Background technique [0002] In the technical field of semiconductor manufacturing, it is often necessary to perform plasma treatment on the substrate to be treated. The process of performing plasma treatment on the substrate to be treated needs to be carried out in plasma treatment equipment. [0003] Plasma processing equipment generally includes a vacuum reaction chamber, and a stage for carrying substrates to be processed is arranged in the vacuum reaction chamber. The stage usually includes a base and an electrostatic chuck arranged above the base for fixing the substrate. The base is connected with a radio frequency source, and a reaction gas is introduced into the vacuum reaction chamber. Under radio frequency excitation, the reaction gas is ionized to generate...

Images