Die-cut adhesive structure and forming method thereof
A molding method and adhesive technology, applied in chemical instruments and methods, lamination auxiliary operations, lamination, etc., can solve the problems of easy dislocation, multiple labor costs, and inability to align metal parts and adhesives.
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[0029] The present invention will be further described below in conjunction with the drawings and embodiments.
[0030] See Figure 1 to Figure 6 Shown is a schematic diagram of a die-cut adhesive structure and its forming method in accordance with the present invention, in which a metal plate 1, a first mold for stamping the metal plate 2, a backing film 3 and a release film 4, and a cutting back The second mold 5 of the film and the suction device 6.
[0031] The metal plate 1 is stamped with a plurality of metal parts 10 through a first mold 2. The first mold 2 has a first upper mold plate 21 and a first lower mold plate 22 matched with the first upper mold plate. It has a number of first through holes 210 the same size as the metal piece 10, and the first lower template 22 has a number of protrusions 220 corresponding to the first through holes 210, so that when the first upper template is dropped, it is stamped and formed The several metal parts 10 mentioned above are receiv...
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