Waste compression device in circuit substrate packaging process

A technology for circuit substrates and compression devices, applied in the field of compression devices, can solve the problems of increased labor force, increased waste, multilateral scraps, etc., and achieves the effects of increasing the utilization rate of effective space, facilitating handling and improving stability

Inactive Publication Date: 2017-07-14
南京市罗奇泰克电子有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] In the packaging production process of circuit substrates, a lot of packaging films will be encountered, and in order to effectively package circuit substrates, more scraps will often be produced, which will increase the waste accumulated in the workshop. of artificial labor

Method used

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  • Waste compression device in circuit substrate packaging process
  • Waste compression device in circuit substrate packaging process
  • Waste compression device in circuit substrate packaging process

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Experimental program
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Embodiment Construction

[0012] The technical scheme of the present invention will be further described below in conjunction with the drawings.

[0013] Such as Figure 1-3 As shown, the waste compression device in the circuit board packaging process of the present invention includes a square base 1, guide support columns 2 respectively provided on the four corners of the base 1, and a square top plate 3. The four corners of the top plate 3 are provided with sliding plates. The block is connected to the guide support column 2 and can slide up and down. The square top plate 3 is also provided with a groove 4 to prevent foot sliding; the device also includes a nitrogen cylinder 7 arranged symmetrically between the guide support columns 2 on both sides. The nitrogen cylinder 7 includes a cylinder block 10 and a cylinder rod 11. The base 1 is provided with a carrier 5 and a box body 6 for storing waste materials. The upper surface of the carrier 5 is provided with a groove for engaging the box body 6 in the...

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Abstract

The invention discloses a waste material compression device in the circuit substrate packaging process, which comprises a square base, guide support columns respectively arranged on the four corners of the base and a square top plate, the top plate is connected with the guide support column through a slider, and can be moved up and down along the base Sliding, the device also includes nitrogen cylinders symmetrically arranged between the guide support columns. The advantage is that the device is not only simple in structure, convenient, lightweight, and safe; first, the guide support column is used to not only support and position the top plate, but also to make it slide up and down to perform compression; secondly, the symmetrical nitrogen cylinder is used, compared with As far as the spring is used, the safety performance is improved.

Description

Technical field [0001] The invention belongs to the field of compression devices, and particularly relates to a waste compression device in a circuit substrate packaging process. Background technique [0002] In the packaging and production process of circuit substrates, many packaging films will be encountered, and in order to efficiently package the circuit substrates, more scraps are often generated, which will increase the amount of waste accumulated in the workshop. If it is not processed in time, it will increase the follow-up Labor force. [0003] Therefore, there is an urgent need for a waste compression device in the circuit board packaging process that has a simple structure and is convenient for use in packaging. Summary of the invention [0004] Objective of the invention: The objective of the present invention is to provide a waste compressing device in the circuit substrate packaging process that is simple in structure, portable and flexible, and safe. [0005] Technic...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B30B9/30
CPCB30B9/3053B30B9/3003B30B9/3032
Inventor 楼方禄
Owner 南京市罗奇泰克电子有限公司
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