Waste compression device in circuit substrate packaging process

A technology for circuit substrates and compression devices, applied in the field of compression devices, can solve the problems of increased labor force, increased waste, multilateral scraps, etc., and achieves the effects of increasing the utilization rate of effective space, facilitating handling and improving stability
CN106945333AInactive Publication Date: 2017-07-14南京市罗奇泰克电子有限公司
9 Cites 0 Cited by

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
南京市罗奇泰克电子有限公司
Publication Date
2017-07-14
Estimated Expiration
Not applicable · inactive patent

Smart Images

  • Figure 1
    Figure 1
  • Figure 2
    Figure 2
  • Figure 3
    Figure 3
Patent Text Reader

Abstract

The invention discloses a waste material compression device in the circuit substrate packaging process, which comprises a square base, guide support columns respectively arranged on the four corners of the base and a square top plate, the top plate is connected with the guide support column through a slider, and can be moved up and down along the base Sliding, the device also includes nitrogen cylinders symmetrically arranged between the guide support columns. The advantage is that the device is not only simple in structure, convenient, lightweight, and safe; first, the guide support column is used to not only support and position the top plate, but also to make it slide up and down to perform compression; secondly, the symmetrical nitrogen cylinder is used, compared with As far as the spring is used, the safety performance is improved.
Need to check novelty before this filing date? Find Prior Art

Description

Technical field

[0001] The invention belongs to the field of compression devices, and particularly relates to a waste compression device in a circuit substrate packaging process. Background technique

[0002] In the packaging and production process of circuit substrates, many packaging films will be encountered, and in order to efficiently package the circuit substrates, more scraps are often generated, which will increase the amount of waste accumulated in the workshop. If it is not processed in time, it will increase the follow-up Labor force.

[0003] Therefore, there is an urgent need for a waste compression device in the circuit board packaging process that has a simple structure and is convenient for use in packaging. Summary of the invention

[0004] Objective of the invention: The objective of the present invention is to provide a waste compressing device in the circuit substrate packaging process that is simple in structure, portable and flexible, and safe.

[0005] Technic...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More