Bionic principle-based structure cooling channel layout optimization design method

Abstract

The invention relates to a bionic principle-based structure cooling channel layout optimization design method. The method comprises the steps of firstly building a geometric model for design according to the shape size of a design object, then applying a heat source and heat boundary conditions to a structure according to actual working conditions, and performing finite element heat analysis to obtain heat dissipation of each unit; and by adopting a cooling channel layout optimization design mathematic model, repeatedly updating a section area of a cooling channel according to a growth mechanism of a natural branch system, namely, a branch always grows according to a direction and a speed of enabling the whole system function to be optimal, until the total volume of the grown cooling channel reaches a predetermined total volume upper limit qV0. Through the optimization design method, the cooling channel layout is reasonable and the cooling efficiency can be improved; and compared with empirical design and analogical design adopted by a conventional cooling channel layout, an optimal layout under complex heat boundary conditions can be realized.

Description

technical field [0001] The invention relates to a heat transfer structure design method, in particular to a bionic optimization design method for heat dissipation channels distributed on a plate shell structure. Background technique [0002] As the size of electronic products decreases and the degree of integration of internal components increases, whether the heat can be dissipated in a timely manner determines the performance and service life of such products. Therefore, efficient heat dissipation is a key technology for the further development of such products. Due to the concentrated heat generation and limited heat dissipation space, the traditional method of forced convection heat dissipation for electronic components can no longer meet the actual heat dissipation requirements. The effective way to solve this problem is to lay heat dissipation channels formed with high thermal conductivity materials on the surface of components or directly embed components. Inside the ...

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Problems solved by technology

The layout of traditional heat dissipation channels is generally based on empirical design and analog

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