PCB body automatic fixing and moving mechanism for PCB depaneling machine

Abstract

The invention discloses a PCB body automatic fixing and moving mechanism for a PCB depaneling machine. The PCB body automatic fixing and moving mechanism comprises a lower mold and a lower main guiding block, two sides of the top face of the lower main guiding block are provided with bar-shaped guiding grooves, wear-resisting blocks are fixed on the bottom face and two sides of the guiding block, the wear-resisting blocks press against corresponding inner sidewalls or bottom faces of the bar-shaped guiding grooves a movement guiding block is fixed on the central part of the bottom face of the lower mold, the movement guiding block is inserted into a movement guiding groove in the central part of the top face of the lower main guiding block, an adjusting screw is inserted into the movement guiding groove, two ends of the adjusting screw are hinged to the wall surfaces of the front and rear ends of the movement guiding groove, and a driving motor is fixed on the front end face of the lower main guiding block. The PCB body automatic fixing and moving mechanism can automatically fix and move the PCB body, automatic carrying is achieved, the PCB body automatic fixing and moving mechanism is firm in fixation and convenient to assemble and disassemble, manual assembly and disassembly of the mold are not needed, and the labor quantity is greatly reduced.

Description

[0001] Technical field: [0002] The invention relates to the technical field of circuit board manufacturing and processing, and more specifically relates to a PCB board body automatic fixing and moving mechanism for a PCB splitting machine. [0003] Background technique: [0004] The existing PCB sub-boards generally use manual sub-boards, which have poor effect and low efficiency, and manual sub-boards are easy to damage the board and affect the yield, so mechanical sub-boards are now used; [0005] However, in the existing mechanical sub-panels, it needs to be fixed by a specific mold. The existing mold structure is fixed by bolts, which is troublesome to install and disassemble, and the efficiency is low. Moreover, the existing mold needs to be manually installed on the shelf for processing. It is very troublesome to manually move and load and unload the mold. [0006] Invention content: [0007] The purpose of the present invention is to overcome the deficiencies in the ...

AI Technical Summary

Problems solved by technology

[0004] The existing PCB sub-boards generally use manual sub-boards, which have poor effect and low efficiency, and manual sub-boards are easy to damage the board and affect the yield, so mechanical sub-boards are now used;

[0005] However, in the existing mechanical sub-panels, it needs to be fixed by a specific mold. The existing mold structure is fixed by bolts, which is troublesome to install and disassemble and has low efficiency. It is very troublesome to manually move and load and unload the mold

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