Ultrafine double-sided adhesive tape die cutting technology

Abstract

The invention provides an ultrafine double-sided adhesive tape die cutting technology. The ultrafine double-sided adhesive tape die cutting technology comprises the following steps that double-sided adhesive tape is provided, a heavy release film is attached to the bottom layer of the double-sided adhesive tape, the surface layer of the double-sided adhesive tape is provided with original release paper in an attached mode, and the whole double-sided adhesive tape is cut into a coil-shaped material strip; partial roller cutting is conducted on one side of the original release paper surface until a cutter arrives at the double-sided adhesive tape, the portion, located at the roller cutting position, of the double-sided adhesive tape and the portion, located at the roller cutting position, of the original release paper are torn away, and the heavy release film region is exposed and serves as a handle portion; the original release paper attached to the double-sided adhesive tape is torn away and replaced by a light release film; the material strip is inverted, the heavy release film surface is upwards placed to be processed through die cutting, cutoff is conducted until the cutter arrives at the double-sided adhesive tape layer, after first-time cutoff of the cutter is accomplished, the double-sided adhesive tape is driven by the material strip to backwards move by the width distance of the needed double-sided adhesive tape, cutting is conducted again, after second-time cutoff of the cutter is accomplished, the double-sided adhesive tape is driven by the material strip to backwards move by the spacing distance, cutting is conducted again, and the step is circularly conducted; and the double-sided adhesive tape width between the first-time cutoff operation and the second-time cutoff operation is reserved, and waste materials are torn away. The ultrafine double-sided adhesive tape die cutting technology achieves complete die cutting of the ultrafine double-sided adhesive tape, and avoids the adhesive overflowing adhesion phenomenon.

Description

technical field [0001] The invention belongs to the technical field of film die-cutting, and in particular relates to a superfine double-sided adhesive die-cutting process. Background technique [0002] As mobile phones and computers use double-sided tape more and more widely, traditional die-cutting production is suitable for regular-sized double-sided tapes. For the limit size, the use of mold punching not only has low production capacity, but also has a high defect rate. The existing double-sided adhesive manufacturing process includes mold opening, making corresponding molds according to the drawings; material preparation, according to the corresponding specification materials equipped with molds; punching, normal process for product punching; waste packaging. The use of molds is limited by size, and it is impossible to complete the process of ultra-fine products. Contents of the invention [0003] The purpose of the present invention is to solve the above technical ...

AI Technical Summary

Problems solved by technology

The use of molds is limited by size, and it is impossible to complete the process of ultra-fine products

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