Thermocompression bonding device

Abstract

The invention discloses a thermocompression bonding device that uses thermocompression to bond a chip to a substrate. The thermocompression bonding device based on the embodiment of the invention is characterized in that it includes: bonding a single unit semiconductor chip on the substrate and A suction head that picks up semiconductor chips, a film supply device that feeds the film to the bottom of the suction head, and a punching device that perforates the film. The punching device includes: a base; a punching pin installed on the base for perforating the film; a holding block supporting the bottom of the film and forming a through-pin accommodation hole, the holding block can move up and down, when the holding block moves downward, The punch pins perforate the film.

Description

technical field [0001] The present invention relates to a thermocompression bonding device, and in more detail, relates to a thermocompression bonding device that uses thermocompression to bond a chip to a substrate. Background technique [0002] The process of attaching a semiconductor chip to a circuit board generally needs to be performed very precisely, and the substrate has multiple mounting areas for securing the semiconductor chip. On the other hand, the semiconductor chip needs to be electrically connected accurately to the mounting area of ​​the circuit board, and the semiconductor chip needs to be mounted in the correct position (pattern) of the mounting area in order to reduce the defective rate. [0003] The mounting process of the semiconductor chip may be referred to as a bonding process. Based on the specificity of the process that requires precise work, the overall position of the circuit board and the position of the fixing portion (mounting area) of the se...

AI Technical Summary

Problems solved by technology

[0006] However, in this thermocompression method, the adhesive flows upward from the side and sticks to the bottom of the bonding pickup due to the pressure when the bonding pickup squeezes the chip, or due to the gas generated during heating of the adhesive, Issues with bond picker contamination

[0007] On the other hand, precision is important for existing thermocompression bonding equipment, but when the bonding picker is moved by the gantry, the precision cannot be ensured due to vibration based on the movement of the X-axis and Y-axis, and, when a The accuracy cannot be verified when another bonding picker is in operation while another bonding picker is in operation, therefore, in a thermocompression bonding setup, only one bonding picker can be used for thermocompression bonding of a wafer

Therefore, existing thermocompression bonding devices can only be low-throughput (UHP) devices

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