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cutting device

A technology of cutting device and cutting ring, which is applied to fine working devices, electrical components, manufacturing tools, etc., can solve the problems of high cost, high precision adjustment, and troublesome replacement of worktables.

Active Publication Date: 2019-03-12
MITSUBOSHI DIAMOND IND CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, not only is it troublesome to replace the table and its surrounding parts, but also it takes a lot of time and effort to adjust the accuracy after the replacement, and there is a problem that the cost becomes high.

Method used

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Experimental program
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Embodiment Construction

[0031] Next, the cutting device 10 according to the embodiment of the present invention will be described. The cutting device 10 has the ability to figure 1 The stage 11 moves in the positive and negative directions of the y-axis shown. Below the stage 11 is provided a Y-axis moving mechanism 12 that moves the stage 11 in the y-axis direction along its surface and further rotates the stage 11 along its surface. A U-shaped horizontal fixing member 13 is provided on the upper part of the stage 11, and a servo motor 14 is held on the upper part. A ball screw 15 is directly connected to the rotation shaft of the servo motor 14 , and the lower end of the ball screw 15 is supported by another horizontal fixing member 16 so that the ball screw 15 can rotate. The upper moving member 17 has a female thread 18 screwed with the ball screw 15 at the center, and has support shafts 19a, 19b downward from both ends of the upper moving member 17 . The support shafts 19 a and 19 b pass thro...

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PUM

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Abstract

The invention relates to a brake apparatus in which cutting rings in different sizes can be selected and fixed onto a work bench. The work bench (47) is arranged on a base ring (43, 44) that freely rotates through a cross roller bearing (41). A first cutting ring (51) is arranged on the work bench (47) with separation by an elastic board (52); in addition, instead of the elastic board (52) and the first cutting ring (51), a protective positioning board (53) are disposed on the work bench. An elastic board (54) is arranged in the center part of the protective positioning board (53) for mounting a second cutting ring (55). A ring accommodating unit (60) can selectively install a pressing arm according to the size of the cutting rings by changing the pressing arms (64, 67) in different sizes.

Description

technical field [0001] The present invention relates to a cutting device for cutting a brittle material substrate attached to a dicing ring via an adhesive material, and more particularly to a cutting device capable of selectively installing a plurality of types of dicing rings of different sizes on a table. Background technique [0002] Patent Document 1 shows a cutting device that holds a dicing ring provided with a semiconductor wafer on a table, and cuts by pressing a cutting bar from the upper portion thereof. In such a dicing device, scribe lines are formed in advance in a grid on a semiconductor wafer held by a dicing ring on a stage. When cutting the substrate into a lattice, the cutting bar is pressed down along one scribed line to cut. Then, the table is moved in parallel in a fixed direction, and the semiconductor wafer is sequentially cut along a plurality of scribe lines. Next, the table is rotated about 90°, and the cutting bar is sequentially pressed along t...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B28D5/04B28D5/00
CPCB28D5/0082B28D5/042B28D5/0052H01L21/6835H01L21/68721H01L21/76H01L21/78
Inventor 三谷卓朗郝鹏飞
Owner MITSUBOSHI DIAMOND IND CO LTD