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Chuck workbench

A chuck table and workpiece technology, applied in electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve problems such as clogging of the chuck table

Active Publication Date: 2017-08-01
DISCO CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, since there is a small gap between the workpiece unit and the chuck table, there is a problem that the machining fluid containing machining chips is sucked into the gap and the chuck table (especially the negative pressure transmission path) blockage

Method used

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  • Chuck workbench
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Experimental program
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Embodiment Construction

[0019] An embodiment of one aspect of the present invention will be described with reference to the drawings. figure 1 It is a perspective view schematically showing a configuration example of a cutting device including the chuck table of the present embodiment. In addition, in this embodiment, although the cutting device is taken as an example and described, the processing device of the present invention may be a grinding device, a grinding device, or the like.

[0020] Such as figure 1 As shown, the cutting device (processing device) 2 has a base 4 that supports each structure. A rectangular opening 4 a long in the X-axis direction (front-rear direction, machining feed direction) is formed on the upper surface of the base 4 . In this opening 4a, an X-axis moving table 6, an X-axis moving mechanism (not shown) for moving the X-axis moving table 6 in the X-axis direction, and a dust-proof and anti-dust mechanism for covering the X-axis moving mechanism are provided. Drop co...

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PUM

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Abstract

A chuck workbench is provided to prevent clogging due to intrusion of a liquid. A chuck workbench (10, 38) is provided in a processing device (2) for processing a plate-shaped to-be-processed workpiece (11) and holds a to-be-processed workpiece unit (1). The to-be-processed workpiece unit (1) is composed of a to-be-processed workpiece, an annular frame (15) surrounding the to-be-processed workpiece, and an adhesive tape (13) attached to the to-be-processed workpiece and the frame. The chuck workbench has a main body (42) having a holding face (42a) for attracting and holding the to-be-processed workpiece through separation via an adhesive tape; and a frame supporting portion (48) located outside the main body and used for supporting the frame, the frame supporting portion having an external diameter smaller than that of the frame. When the frame is overlapped at the frame supporting portion to make an outer edge (15a) of the frame extend outside the frame supporting portion, the entire upper surfaces of the main body and the frame supporting portion are covered by the to-be-processed workpiece unit.

Description

technical field [0001] The present invention relates to a chuck table for attracting and holding a plate-shaped workpiece. Background technique [0002] In a processing apparatus that processes workpieces such as semiconductor wafers and package substrates, for example, a chuck table that sucks and holds the workpiece using negative pressure (vacuum) is installed. The workpiece can be sufficiently processed with high precision by attracting and holding the workpiece by the chuck table. [0003] In recent years, in order to easily handle the workpiece before and after processing, the opportunity to form a workpiece unit (frame unit) by sticking an adhesive tape larger in diameter than the workpiece to the workpiece and Fix the ring-shaped frame to the outer edge of the adhesive tape. In this case, the chuck table is configured to be able to hold the entire workpiece unit (for example, refer to Patent Document 1). [0004] Patent Document 1: Japanese Patent Laid-Open No. 20...

Claims

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Application Information

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IPC IPC(8): H01L21/683
CPCH01L21/683
Inventor 福冈武臣
Owner DISCO CORP