Dividing device and dividing method of wafer

Abstract

To maintain the chip interval appropriately, by removing wrinkles from a tape by a simple device configuration. A dividing method of a wafer using a division device for dividing a wafer (W) supported on a ring frame (F) via a tape (T) into individual chips (C) at division start points along a division line has: a holding step of holding the ring frame on a ring frame holding section (20), and holding a wafer on the inside of the ring frame on a holding table (10); a division step of stretching the tape by separation of the holding table and the ring frame holding section, thus dividing the wafer at the division start points; and a rip separation step of separating a chip by thermally contracting the heating range of a heater (51) for thermally shrinking the stretched tape by a predetermined heating range, at a time, in the circumferential direction or radial direction between the outer periphery of the wafer and the inner periphery of the ring frame.

Description

technical field [0001] The present invention relates to a dividing device for dividing a wafer into individual chips along a planned dividing line and a method for dividing the wafer. Background technique [0002] In recent years, a method for increasing the number of chips to be obtained from one wafer by reducing the line width of the planned dividing line of the wafer has been known (for example, refer to Patent Document 1). In the method for dividing a wafer described in Patent Document 1, a modified layer along a line to be divided is formed inside the wafer by irradiating a laser beam which is transparent to the wafer. Thereafter, the tape attached to the ring frame is expanded by an expanding device or the like, whereby an external force is applied to the wafer attached to the upper surface of the tape, and the wafer is divided into individual chips starting from the modified layer. [0003] Although the gap between chips is enlarged by the stretching of the tape, wh...

AI Technical Summary

Problems solved by technology

[0007] However, since tension is applied in one direction of the tape when the tape is bonded to the ring frame, it is easy to place the tape opposite the wafer in the other direction perpendicular to the direction to which the tension is applied. become radially relaxed folds

In this case, in the method of Patent Document 2, since the tape between the outer periphery of the wafer and the inner periphery of the ring frame is uniformly heated, wrinkles cannot be sufficiently removed from the tape.

In the method of Patent Document 3, a structure for thermocompression-bonding the tape over the entire range in the circumferential direction is required, and the device structure becomes complicated.

Images