Semiconductor systems based on temperature monitoring
A semiconductor and refrigeration chip technology, applied in the field of radar, can solve the problems that the radar front is not in a sealed environment and is easily eroded by the external environment.
Active Publication Date: 2019-05-07
启珑微电子(北京)有限公司
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Problems solved by technology
[0004] The technical problem to be solved by the present invention is that most of the current radar arrays use forced air cooling for heat dissipation. In this way, the radar arrays are not in a sealed environment and are easily eroded by the external environment. The purpose is to provide a semiconductor system based on temperature monitoring to solve above question
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[0022] Such as figure 1 As shown, the semiconductor system based on temperature monitoring of the present invention includes two or more semiconductor refrigeration sheets 2, heat pipes 3, heat dissipation boxes 4, heat dissipation fins 5, air inlet fans 6 and air outlet fans 7; The cooling sheet 2 is arranged on the inner wall of the radar front 1, and the cold end of the semiconductor cooling sheet 2 faces the inside of the radar front 1; the hot ends of the two or more semiconductor cooling sheets 2 are connected in series through the heat pipe 3, and the ends of the heat pipe 3 The part extends into the heat dissipation box 4; the heat dissipation box 4 is arranged on the outside of the radar front 1, and the part of the heat pipe 3 extending into the heat dissipation box 4 is provided with a cooling fin 5; the heat dissipation box 4 is provided with an air intake fan 6 and The air outlet fan 7, and the air inlet fan 6 and the air outlet fan 7 are arranged oppositely; The...
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The invention discloses a semiconductor system based on temperature monitoring. Two or more than two semiconductor refrigeration sheets are disposed on an inner wall of a radar array plane, and the cool ends of the semiconductor refrigeration sheets face the inner part of the radar array plane. The hot ends of the two or more than two semiconductor refrigeration sheets are serially connected together by heat pipes, and the end parts of the heat pipes are inserted in a heat dissipation box, which is disposed on the outer part of the radar array plane. The parts of the heat pipes inserted in the heat dissipation box are provided with radiation fins. The heat dissipation box is provided with an air inlet fan and an air outlet fan, which are in an opposite arrangement, and the surface of the air inlet fan and the surface of the air outlet fan face the fin ends of the radiation fins. The semiconductor system based on the temperature monitoring is advantageous in that the heat energy of the radar array plane is transferred to the outer part of the radar array plane for concentrated heat dissipation, and the ventilation of the radar array plane is not required, and therefore the radar array plane is in closed environment, and cannot be eroded by external environment.
Description
technical field [0001] The invention relates to the field of radar, in particular to a semiconductor system based on temperature monitoring. Background technique [0002] Any radar is produced, transported, stored and used under certain environmental conditions, and the influence of temperature on radar systems is particularly important. High, low temperature and their cycle will have a serious impact on most electronic components in the radar, which will lead to the failure of electronic components, and then affect the failure of the entire radar equipment, which is most prominent in the active phased array radar. With the miniaturization and miniaturization of electronic components, the high integration and micro-assembly of integrated circuits, the heat flux of components and components continues to increase, and thermal design is also facing severe challenges. The thermal design of modern electronic equipment is based on heat transfer and fluid mechanics, combined with ...
Claims
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IPC IPC(8): H05K7/20
CPCH05K7/20145H05K7/20172H05K7/20336H05K7/2039
Inventor 阳安源
Owner 启珑微电子(北京)有限公司