A kind of compound electrode type pH sensor based on cmos technology and preparation method thereof
A composite electrode and pH sensor technology, which is applied in the direction of instruments, scientific instruments, and material electrochemical variables, can solve the problems of high sensor processing technology requirements, inability to use solid-state environment detection, and cumbersome testing process, etc., to achieve easy integration, The effect of improving stability and improving reliability
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Embodiment 1
[0048] Such as figure 1 Shown, a kind of compound electrode type pH sensor based on CMOS technology described in the present invention, described compound electrode type pH sensor based on CMOS technology comprises substrate 1, sensing area 2, working electrode 3, electrode lead wire 4 and welding Disk 5. Wherein, the working electrode 3 is made above the sensing detection area 2, and the reference electrode 24 is located inside the sensing detection area 2; the pad 5 includes a reference electrode output terminal 51, a voltage input positive terminal 52, and a working electrode output terminal 53 And voltage input negative terminal 54.
[0049] Such as figure 2 As shown, a rectangular groove 11 is formed on the front of the base 1, and four long grooves are formed on the upper side of the rectangular groove 11, namely, long groove I12, long groove II13, long groove III14, and long groove IV15. The sensing area 2 is made on the rectangular groove 11, the electrode leads 4 ...
Embodiment 2
[0071] Such as Figure 8 As shown, the difference between the second embodiment of the compound electrode pH sensor based on the CMOS process of the present invention and the first embodiment is that the silicon substrate is an N-type silicon substrate 2002; the well region is the first The P-well region 20031 , the second P-well region 20032 and the third P-well region 20033 ; the external voltage applied to the positive voltage input terminal 52 and the negative voltage input terminal 54 is a reverse voltage.
[0072] The difference between the preparation method of the second embodiment of the present invention and the preparation method of the first embodiment lies in step S2, which is specifically: making a semiconductor substrate and a well region, and depositing an epoxy resin layer at the bottom of the rectangular groove 11 by spin coating 21. Paste the cleaned N-type silicon wafer with a length of about 18 mm, a width of about 8 mm, and a thickness of about 1 mm on th...
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Abstract
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