Vacuum chuck apparatus

Abstract

The present invention relates to a vacuum chuck apparatus that comprises a vacuum chuck unit that uniformly applies a suction pressure generated in a chamber to the entire surface of a suction part such that a subject on which a work or experiment is performed can be more stably mounted thereon; and a frame that makes the vacuum chuck unit installed while being maintained at a working height and receives a peripheral apparatus for driving the vacuum chuck unit so as to implement the vacuum chuck apparatus and the peripheral apparatus as a single apparatus, wherein the vacuum chuck unit is constituted by coupling a porous suction part and a base that has the chamber for generating a suction pressure such that the suction pressure generated in the chamber is uniformly applied to the entire surface of the suction part, thereby enabling a subject to be more stably mounted on the suction part.

Description

technical field [0001] The invention relates to a vacuum chuck device. [0002] In detail, the present invention relates to a vacuum chuck device, which includes a vacuum chuck configuration part that enables a suction pressure generated in a chamber to be applied on the entire surface of the suction part, and a frame. Uniformly generated, so that the object used to perform work or experiments can be installed more stably, and the frame is used to set the vacuum chuck configuration part in a state where the work height is maintained, and to drive the vacuum Peripheral devices of the chuck configuration section are accommodated to realize a single device. [0003] In addition, the present invention relates to a vacuum chuck device in which an image acquisition device (camera) is installed on the upper part of the vacuum chuck configuration part on the frame, and the image acquisition device is used to observe the working or experimental conditions of the object, so The above-...

AI Technical Summary

Problems solved by technology

[0009] In the vacuum chuck of the above-mentioned patented invention, because the vacuum hole is formed in the form of a passage, a considerable suction pressure is generated only vertically above the vacuum hole, so that the entire vacuum degree of the suction surface where the object is adsorbed is uneven.

[0010] As a result, the uneven vacuum degree of the entire adsorption surface may cause the position of the object to be dislodged due to the slight impact generated when the object to be adsorbed is processed, thus exposing the problem of causing considerable operational failure.

[0011] In particular, as mentioned above, when the degree of vacuum on the suction surface is impossible, only a single object should be mounted on a single vacuum chuck, and it is applicable to the processing of semiconductors or various materials, although there is no large force However, in the case of simultaneous experiments on multiple objects in the laboratory, it will expose the problem that it is difficult to apply

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