Adhesive sticking device

A gluing device and tape technology, applied in the secondary processing of printed circuits, electrical components, printed circuit manufacturing, etc., can solve the problem of unstable quality of workpiece gluing, difficulty in ensuring the position accuracy of workpiece gluing, and low efficiency of manual gluing, etc. question

Active Publication Date: 2017-09-01
GUANGDONG TIANJI IND INTELLIGENT SYST CO LTD
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  • Abstract
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  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Since the area of ​​the electronic components is usually relatively small, and the material of the insulating glue is relatively soft, it is often difficult to guarantee the accuracy of the workpiece gluing position by manual gluing, resulting in unstable quality of the workpiece gluing, and the efficiency of manual gluing is relatively low.

Method used

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Embodiment Construction

[0051] In order to facilitate the understanding of the present invention, the present invention will be described more fully below with reference to the associated drawings. Preferred embodiments of the invention are shown in the accompanying drawings. However, the present invention can be embodied in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present invention more thorough and comprehensive.

[0052] It should be noted that when an element is referred to as being “fixed” to another element, it can be directly on the other element or there can also be an intervening element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and similar expressions are used herein for purposes of ill...

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Abstract

The invention relates to an adhesive sticking device, which comprises a rack, a material supply mechanism, a turntable, a material taking mechanism, a material pressing mechanism and a feeding mechanism, wherein the material supply mechanism is arranged on the rack, and is used for discharging workpieces in order one by one; the turntable is arranged on the rack in a rotating manner, and multiple carriers are arranged on the outer edge of the turntable at equal intervals; the material taking mechanism comprises a mechanical hand and a first adsorption component arranged on the mechanical hand, the mechanical hand is used for driving the first adsorption component to move between the carriers and the material supply mechanism, and the first adsorption component is used for taking and placing the workpieces; the material pressing mechanism is used for pressing an adhesive tape downwards to be closely attached to the workpieces placed on the carriers; the feeding mechanism is used for moving the workpieces closely attached to the adhesive tape out of the carriers. Compared with a traditional manual adhesive sticking manner, the adhesive sticking device has the advantages that manual workpiece placement errors can be greatly reduced, thereby ensuring the accuracy of the adhesive sticking positions of the workpieces and improving the stability of the adhesive sticking quality of the workpieces; in addition, the adhesive sticking efficiency of the workpieces can be greatly improved, and the labor cost investment can be reduced.

Description

technical field [0001] The invention relates to the processing field of electronic components, in particular to a glue sticking device. Background technique [0002] The outer surface of many electronic components on the circuit board usually needs to be pasted with a layer of insulating glue, so as to overcome the interference of external electromagnetic waves on the electronic components. At present, the glue is usually pasted manually, and the operator sticks the tape to the surface of the electronic component through tweezers. Since the area of ​​the electronic components is usually relatively small, and the material of the insulating glue is relatively soft, it is often difficult to guarantee the accuracy of the workpiece glueing position by manual glue application, resulting in unstable quality of workpiece glue glue, and the efficiency of manual glue glue is relatively low. . Contents of the invention [0003] Based on this, it is necessary to provide a gluing dev...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/28
CPCH05K3/284H05K2203/1377
Inventor 游庆华向尧臣陈双
Owner GUANGDONG TIANJI IND INTELLIGENT SYST CO LTD
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