10 results about "Tape-out" patented technology

The present disclosure provides a method and a non-transitory computer-readable medium for arranging components within a semiconductor device. The method includes providing a plurality of electrical components in a pre-layout, generating a first layout by routing the plurality of electrical components, obtaining a first resistance between a power terminal of the first layout and a first terminal of a first electrical component in the first layout, comparing the first resistance and a first threshold, adjusting routing of the first layout such that the first resistance is less than the first threshold, and generating a tape out file for the semiconductor device according to the first layout.

The invention discloses a circuit board and a manufacturing method thereof. The polyimide reinforcing plate is attached to the glue-resisting adhesive tape to form the combined adhesive tape, the thickness and hardness of the glue-resisting medium are increased, the problems of excessive glue flowing and poor cover opening are reduced, the combined adhesive tape is provided with the handle, and the combined adhesive tape is dragged out through the handle. According to the method, the damage to glass fibers of the hard core board and the bonding sheet is reduced, the risk of core board breakage is reduced, so that the uncovering production efficiency and the product quality are improved, a plurality of mother boards can be uncovered together through the combined adhesive tape, rapid uncovering is achieved, and compared with a conventional adhesive tape glue blocking process, the uncovering efficiency is improved.

The invention provides a material belt for secondary self-sealing of SMT electronic materials, and relates to collection and packaging of bulk materials after automatic SMT electronic materials are off-line and a feeder is disassembled, the material belt comprises an upper base layer and a lower base layer, and two double-sided adhesive tapes are arranged between the two base layers. And the material belt and the material film of the electronic package material are adhered together again, so that the secondary damage of the scattered material when the feeder is disassembled is avoided, the online treatment time of the scattered material is shortened, and meanwhile, the 5S neatness requirement in the storage process of the electronic material is ensured.

An integrated circuit comprises: a plurality of circuit components physically arranged within a first area of a surface of a semiconductor substrate forming the integrated circuit; a first plurality o

The utility model provides a stator conduction connection structure and a motor, and relates to the technical field of external rotor motors, the stator conduction connection structure comprises a stator iron core, an insulation upper wire frame and an insulation lower wire frame which are designed in a split mode, the insulation upper wire frame is located above the stator iron core, and the insulation lower wire frame is located below the stator iron core; a slot bottom insulator is mounted in the stator core; an enameled wire clamping groove is formed in the insulating upper wire frame and is used for fixing a tap wire of a stator winding in the winding process; the insulating upper wire frame is further provided with a piercing terminal cavity, and a bidirectional piercing terminal is assembled in the piercing terminal cavity to pierce an insulating layer of the enameled wire, so that electrical conduction with the bidirectional piercing terminal is achieved. The beneficial effects of the utility model are that through the optimization of the structure, the motor stator winding can be rapidly connected with the controller end through the upper wire frame, the puncture terminal, the printed circuit board, the wiring terminal and the like, the automatic assembly efficiency of the product is improved, the manufacturing cost is reduced, and the reliability and the comprehensive performance grade of the whole machine product are improved.

A metal organic chemical vapor deposition (MOCVD) device for manufacturing superconducting tapes and a method of fabricating superconducting tapes is disclosed. The device includes an ohmic heat terminal assembly to heat a superconductor substrate tape through ohmic heating. The assembly includes a first roller exterior to a housing and configured to heat multiple superconductor substrate tapes and guide the superconductor substrate tapes to multiple tape tracks and a second roller exterior to the housing and configured to heat the multiple superconductor substrate tapes and guide the heated superconductor substrate tapes out of the multiple tape tracks. Each of the multiple tape tracks includes a first precursor flow channel configured to supply longitudinal laminar precursor flow for deposition on one side of the superconductor substrate tape and a first wall shield flow channel configured to supply longitudinal shield gas flow on the one side of the superconductor substrate tape.

An integrated circuit implementing a partial instance comprises a plurality of circuit components (e.g. including multiplexor circuits) physically arranged on a surface of a semiconductor substrate fo

The present disclosure provides a method and a non-transitory computer-readable medium for arranging components within a semiconductor device. The method includes providing a plurality of electrical components in a pre-layout, generating a first layout by routing the plurality of electrical components, obtaining a first resistance between a power terminal of the first layout and a first terminal of a first electrical component in the first layout, comparing the first resistance and a first threshold, adjusting routing of the first layout such that the first resistance is less than the first threshold, and generating a tape out file for the semiconductor device according to the first layout.

An integrated circuit comprises: a plurality of circuit components physically arranged within a first area of a surface of a semiconductor substrate forming the integrated circuit; a first plurality o