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6 results about "Tape-out" patented technology

In electronics design, tape-out or tapeout is the final result of the design process for integrated circuits or printed circuit boards before they are sent for manufacturing. The tapeout is specifically the point at which the graphic for the photomask of the circuit is sent to the fabrication facility. A synonym used at IBM is RIT (release interface tape). IBM differentiates between RIT-A for the non-metallic structures and RIT-B for the metal layers.

Method and non-transitory computer-readable medium for arranging components within a semiconductor device

The present disclosure provides a method and a non-transitory computer-readable medium for arranging components within a semiconductor device. The method includes providing a plurality of electrical components in a pre-layout, generating a first layout by routing the plurality of electrical components, obtaining a first resistance between a power terminal of the first layout and a first terminal of a first electrical component in the first layout, comparing the first resistance and a first threshold, adjusting routing of the first layout such that the first resistance is less than the first threshold, and generating a tape out file for the semiconductor device according to the first layout.
Owner:TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD

Stator conduction connection structure and motor

The utility model provides a stator conduction connection structure and a motor, and relates to the technical field of external rotor motors, the stator conduction connection structure comprises a stator iron core, an insulation upper wire frame and an insulation lower wire frame which are designed in a split mode, the insulation upper wire frame is located above the stator iron core, and the insulation lower wire frame is located below the stator iron core; a slot bottom insulator is mounted in the stator core; an enameled wire clamping groove is formed in the insulating upper wire frame and is used for fixing a tap wire of a stator winding in the winding process; the insulating upper wire frame is further provided with a piercing terminal cavity, and a bidirectional piercing terminal is assembled in the piercing terminal cavity to pierce an insulating layer of the enameled wire, so that electrical conduction with the bidirectional piercing terminal is achieved. The beneficial effects of the utility model are that through the optimization of the structure, the motor stator winding can be rapidly connected with the controller end through the upper wire frame, the puncture terminal, the printed circuit board, the wiring terminal and the like, the automatic assembly efficiency of the product is improved, the manufacturing cost is reduced, and the reliability and the comprehensive performance grade of the whole machine product are improved.
Owner:FANS TECH ELECTRIC CO LTD

Full die and partial die tape outs from common design

An integrated circuit implementing a partial instance comprises a plurality of circuit components (e.g. including multiplexor circuits) physically arranged on a surface of a semiconductor substrate fo
Owner:APPLE INC

Method and non-transitory computer-readable medium for arranging components within a semiconductor device

The present disclosure provides a method and a non-transitory computer-readable medium for arranging components within a semiconductor device. The method includes providing a plurality of electrical components in a pre-layout, generating a first layout by routing the plurality of electrical components, obtaining a first resistance between a power terminal of the first layout and a first terminal of a first electrical component in the first layout, comparing the first resistance and a first threshold, adjusting routing of the first layout such that the first resistance is less than the first threshold, and generating a tape out file for the semiconductor device according to the first layout.
Owner:TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD

Full die and partial die tape outs from common design

An integrated circuit comprises: a plurality of circuit components physically arranged within a first area of a surface of a semiconductor substrate forming the integrated circuit; a first plurality o
Owner:APPLE INC