The utility model relates to the technical field of
memory bank testing, and provides a
memory testing temperature control mechanism which comprises a housing used for covering a testing mainboard, the housing is divided into a plurality of
temperature control areas which are in one-to-one correspondence with and matched with slot areas of the testing mainboard, and a
temperature control assembly used for providing temperature conditions is arranged in each temperature
control area. The temperature control
assembly comprises a temperature control substrate, a plurality of TEC temperature control sheets and a plurality of temperature control fins, one functional surface of each TEC temperature control sheet is attached to the temperature control substrate, the plurality of temperature control fins are arranged in parallel, and a space between every two adjacent temperature control fins is a temperature
control grid used for accommodating a
memory bank during testing; integrated
refrigeration / heating is achieved through the TEC temperature control pieces, the temperature in the temperature
control grid is correspondingly controlled to be the target temperature, the temperature condition is provided for
memory bank testing, the structure is simple, the space
occupancy rate is small, and therefore the testing space
layout is optimized.