Multilayer flexible circuit board opening method
A flexible circuit board and copper layer technology, which is applied in multilayer circuit manufacturing, printed circuit, printed circuit manufacturing, etc., can solve the problem that the multilayer flexible circuit board cannot be released after opening the cover, and can improve the problem that the cover cannot be released. , Improve the effect of product quality
Active Publication Date: 2019-05-14
CHUNHUA TECHNOLOGICAL KUSN
View PDF2 Cites 0 Cited by
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
[0003] The purpose of the present invention is to provide a multi-layer flexible circuit board opening method that can improve the problem that the multi-layer flexible circuit board cannot be released.
Method used
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View moreImage
Smart Image Click on the blue labels to locate them in the text.
Smart ImageViewing Examples
Examples
Experimental program
Comparison scheme
Effect test
Embodiment 1
[0020] Embodiment 1: A multi-layer flexible circuit board is formed by laminating a single-sided board 1 and a double-sided board 3 through a combination glue 2, wherein the single-sided board 1 is composed of a layer of copper layer 5 and a layer of PI layer, and the double-sided board 3 is composed of a layer of PI layer and two copper layers 5 on both sides thereof.
[0021] See attached figure 1 As shown, a multilayer flexible circuit board uncapping method for realizing uncapping on a multilayer flexible circuit board formed by laminating a single panel 1 and a double panel 3 comprises the following steps:
[0022] (1) Etching the copper layer 5 of the single-sided panel 1 to form a first opening;
[0023] (2) Falsely connect the single-sided panel 1 to the combination glue 2, and etch the PI layer of the single-sided panel 1 and the combination glue 2 to form a second opening, the diameter of the second opening is smaller than that of the first opening;
[0024] (3) Co...
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More PUM
Login to View More Abstract
The invention relates to a multilayer flexible circuit board cover opening method comprising the steps of: (1) etching a copper layer of a single-sided board to form a first opening; (2) connecting the single-sided board with assembly glue and etching a PI layer of the single-sided board and the assembly glue to form a second opening, wherein the aperture of the second opening is smaller than the aperture of the first opening; (3) connecting the single-sided board and the assembly glue which have been connected to a double-sided board to enable the first opening and the second opening to form an open cover zone; (4) plating a copper layer on the bottom and side walls of the open cover zone; (5) using a dry film to cover the opening portion connected to the first opening of the second opening to enable the opening wall of the second opening and the bottom portion of the open cover zone to form a dry film covered zone; (6) selectively plating the area not covered by the dry film; (7) removing the dry film; and (8) etching the copper layer in the area covered by the dry film. The method of the invention can solve the problem that releasing of the open cover in the multilayer flexible circuit board can not be conducted, thereby raising the quality of circuit board products.
Description
technical field [0001] The invention relates to a method for opening a cover area on a multilayer flexible circuit board. Background technique [0002] The design of some multi-layer flexible circuit boards needs to open a cover area on the single sided board to expose the inner layer circuit. In the prior art, for the bonded multi-layer circuit boards, a laser single-sided board is used to form an opening area. When using this method, there is a problem that the area of the opening area is too small and the copper foil cannot be released, which affects the product quality. Contents of the invention [0003] The purpose of the present invention is to provide a multilayer flexible circuit board opening method that can improve the problem that the multilayer flexible circuit board cannot be released. [0004] In order to achieve the above object, the technical scheme adopted in the present invention is: [0005] A method for opening a multilayer flexible circuit board, ...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More Application Information
Patent Timeline
Login to View More Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/46
CPCH05K3/4697
Inventor 方敏聪
Owner CHUNHUA TECHNOLOGICAL KUSN