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A chip bonding device and bonding method

A chip bonding and chip technology, applied in transportation and packaging, semiconductor/solid-state device components, semiconductor/solid-state device testing/measurement, etc., can solve problems such as difficulty in meeting mass production requirements and low yield, and save measurement time, improved precision, and improved bonding yield

Active Publication Date: 2019-05-31
SHANGHAI MICRO ELECTRONICS EQUIP (GRP) CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The disadvantage of this solution is that the entire process is completed serially. For a process with a long press-down bonding time (for example, 30 seconds), since only one chip can be bonded at a time, the yield is very low and it is difficult to meet mass production. need

Method used

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  • A chip bonding device and bonding method
  • A chip bonding device and bonding method
  • A chip bonding device and bonding method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0044] Please refer to image 3 , which is a schematic structural diagram of the measurement system provided in Embodiment 1 of the present invention, the measurement system can simultaneously measure the positions of the chip mark and the substrate mark when the chip and the substrate are bonded. Such as image 3 As shown, the measurement system 10 includes: a first measurement branch and a second measurement branch, the first measurement branch includes a first lighting unit 11 and a first detection unit 12, and the first lighting unit 11 is respectively A light source is provided to the chip mark and the base mark, and the first detection unit 12 respectively images the chip mark and the base mark and measures their positions, and the second measurement branch includes a second illumination unit 13 and a second illumination unit 13. Two detection units 14, the second lighting unit 13 is completely the same as the first lighting unit 11, the second detection unit 14 is comp...

Embodiment 2

[0073] The present invention provides a chip bonding device, which adopts the measuring system described in the first embodiment.

[0074] Please refer to Figure 14 As shown, the difference from the second embodiment is that the first moving table 30 and the second moving table 60 are placed side by side in the horizontal direction, the slide 31 is placed on the first moving table 30, and the chip 20 located above the slide, For the chip mark 21 above the chip, the flipping device 40 only needs to flip once. Specifically, the flipping device 40 includes a first adsorption mechanism 411, a second adsorption mechanism 412, a first flipping mechanism 421 and a driving mechanism 424; After an adsorption mechanism 411 adsorbs the chip 20 from the first moving table 30, the chip mark 21 is located between the first adsorption mechanism 411 and the chip 20, and is turned over by the first turning mechanism 421 to face the second adsorption mechanism 412. , and the chip 20 is handed...

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PUM

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Abstract

The invention provides a chip bonding device and a chip bonding method. The chip bonding device comprises a measurement system, and is characterized in that the measurement system comprises a first measurement branch and a second measurement branch, the first measurement branch comprises a first lighting unit and a first detecting unit, the second measurement branch comprises a second lighting unit and a second detecting unit, the first lighting unit and the first detecting unit detect the positions of X-direction marks on a chip and a substrate in a matched manner, and the second lighting unit and the second detecting unit detect the positions of Y-direction marks on the chip and the substrate in a matched manner, so that the positions of the chip marks and the substrate marks are synchronously measured, and the measurement time is saved. The chip bonding device provided by the invention can directly absorb a chip from a first moving platform and realize overturn of the chip through setting an overturn device; and meanwhile, the chip bonding device measure the positions of the chip marks and the substrate marks synchronously through setting the measurement system, so that the bonding yield is improved from the two aspects. In addition, the chip bonding device realizes high-precision bonding through adjusting the attitude of a second moving platform.

Description

technical field [0001] The invention relates to the technical field of semiconductors, in particular to a chip bonding device and a bonding method. Background technique [0002] The flip chip bonding process is a form of interconnection formed by connecting a chip to a carrier. Due to the development of electronic products in the direction of lightness, thinness and miniaturization, the application of chip bonding technology is increasing. Combining chip bonding technology with wafer-level packaging technology can produce smaller package size and higher performance. packaging form. In addition, since the KGD (know good die) of the chip can be known in advance, if the chip bonding process is combined with the through-silicon via (TSV) process, a three-dimensional structure with more competitive cost and performance can be produced. . [0003] The existing chip flip-chip bonding equipment picks up a single chip from the source through a suction head that matches the size of...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/544H01L21/66H01L21/67H01L21/677
CPCH01L21/67282H01L21/677H01L22/20H01L22/30H01L23/544H01L24/01H01L24/80
Inventor 陈飞彪郭耸戈亚萍
Owner SHANGHAI MICRO ELECTRONICS EQUIP (GRP) CO LTD