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Hydroxyl-containing polyurethane resin, polyurethane resin and urethane (meth)acrylate resin

A technology of polyurethane and acrylate, applied in the direction of polyurea/polyurethane coatings, coatings, etc., can solve the problems of reduced electrical conductivity, damaged surface, lack of softness, etc., and achieve less reduction in electrical conductivity and better reliability high effect

Active Publication Date: 2020-10-13
RESONAC CORPORATION
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

As these transparent conductive films, conventionally, transparent conductive films using ITO (indium tin oxide) have been used, but there are problems in that the supply stability of indium is low, the manufacturing cost is high, the flexibility is lacking, and the need high temperature
[0003] However, for transparent conductive films containing silver nanowires, there are problems such as large surface area per unit weight of silver, easy reaction with various compounds, and lack of environmental resistance. nanostructures are easily corroded and their electrical conductivity is reduced
In addition, especially in applications such as electronic materials, there is the following problem: In order to prevent particulate impurities, dirt, dust, etc. from adhering to and mixing with the surface of the substrate, a physical cleaning process using a brush or the like is often used. damaged surface

Method used

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  • Hydroxyl-containing polyurethane resin, polyurethane resin and urethane (meth)acrylate resin
  • Hydroxyl-containing polyurethane resin, polyurethane resin and urethane (meth)acrylate resin
  • Hydroxyl-containing polyurethane resin, polyurethane resin and urethane (meth)acrylate resin

Examples

Experimental program
Comparison scheme
Effect test

Synthetic example 1

[0245] In a 2L three-neck flask equipped with a stirring device, a thermometer, and a condenser, C-1015N (manufactured by Kuraray Co., Ltd., polycarbonate diol, raw material diol molar ratio: 1,9-nonanediol) was charged as a polyol compound Alcohol / 2-methyl-1,8-octanediol=15 / 85, molecular weight 964) 211 g, 2,2-dimethylol butyric acid (manufactured by Nippon Kasei Co., Ltd.) which is a dihydroxy compound having a carboxyl group 40.0 g and 379 g of γ-butyrolactone (manufactured by Mitsubishi Chemical Corporation) as a solvent, and the aforementioned 2,2-dimethylolbutyric acid was dissolved at 90°C.

[0246] The temperature of the reaction solution was lowered to 70° C., and using a dropping funnel, Desmodile (registered trademark)-W (methylene bis(4-cyclohexyl isocyanate), Sumika Bioleuretan) was added dropwise as a polyisocyanate compound over 30 minutes. Co., Ltd.) 128 g. After the dropwise addition, react at 80°C for 1 hour, then react at 100°C for 1 hour, then react at 120...

Synthetic example 2

[0250] Using the same apparatus as in Synthesis Example 1, 212 g of GI-1000 (manufactured by Nippon Soda Co., Ltd., hydrogenated hydroxylated polybutadiene at both ends (1,2-skeleton 90%), molecular weight 1729) was used as a polyol compound. 63.3 g of 2,2-dimethylolbutyric acid (manufactured by Nippon Kasei Co., Ltd.) as a dihydroxy compound having a carboxyl group, 398 g of diethylene glycol monoethyl ether acetate (manufactured by Daicel Co., Ltd.) as a solvent, and 122 g of Desmoglul (registered trademark)-I (isophorone diisocyanate, manufactured by Sumika Bayer Uletan Co., Ltd.) which is a polyisocyanate compound, and reacted in the same manner as in Synthesis Example 1. The number average molecular weight of the obtained carboxyl group-containing polyurethane was 10600, and the acid value of its solid content was 59.8 mg-KOH / g.

Synthetic example 3

[0252]Using the same apparatus as in Synthesis Example 1, 117 g of PTXG-1000 (a polyether copolymer of 1,4-butanediol-neopentyl glycol (manufactured by Asahi Kasei Shini Co., Ltd.)) having a molecular weight of 1000 as a polyol compound was used. 64.1 g of 2,2-dimethylolbutyric acid (manufactured by Nippon Kasei Co., Ltd.), a dihydroxy compound of carboxyl group, 304 g of diethylene glycol monoethyl ether monoacetate (manufactured by Daicel Co., Ltd.) as a solvent, and As a polyisocyanate compound, 122 g of Desmogul (registered trademark)-I (isophorone diisocyanate, manufactured by Sumika Bayer Uletan Co., Ltd.) was reacted in the same manner as in Synthesis Example 1. The obtained carboxyl group-containing polyurethane The number average molecular weight is 6120, and the acid value of its solid content is 79.8mg-KOH / g.

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Abstract

An object of the present invention is to provide a protective film resin that can be used as a protective film for metal nanowires, has excellent environmental resistance and scratch resistance, and can be cured by radiation such as UV. The present invention provides a protective film resin in which a polyisocyanate compound (Q) or polyisocyanate compound (Q) or A compound (R) having a (meth)acryloyl group and an isocyanate group, wherein the hydroxyl-containing polyurethane resin is characterized in that it has: a polyurethane skeleton (A) having a carboxyl group; The aliphatic oxide ring-opening addition part (B) to which at least a part is bonded, and the aliphatic oxide ring-opening addition part (B) comprises an alkene oxide ring-opening addition part represented by the following formula (b1) Or a cycloolefin oxide ring-opening addition moiety represented by the formula (b2). (In formula (b1), n 1 is an integer from 1 to 50, R 1 , R 2 Each independently represents a hydrogen atom, an alkyl group having 1 to 16 carbon atoms, or a phenyl group. )(In formula (b2), n 2 is an integer of 1 to 10, and Z is an atomic group forming an alicyclic hydrocarbon group having 4 to 14 carbon atoms including 2 carbon atoms to which Z is bonded. )

Description

technical field [0001] The present invention relates to hydroxyl-containing polyurethane resins, polyurethane resins and urethane (meth)acrylate resins using them as raw materials, methods for producing these resins, and outer coatings Composition and UV curable resin composition. Background technique [0002] Transparent conductive films have been used in transparent electrodes of liquid crystal displays (LCD), plasma display panels (PDP), organic electroluminescent displays, solar cells (PV) and touch panels (TP), antistatic (ESD) films and In various fields such as electromagnetic wave shielding (EMI) film. As these transparent conductive films, conventionally, transparent conductive films using ITO (indium tin oxide) have been used, but there are problems in that the supply stability of indium is low, the manufacturing cost is high, the flexibility is lacking, and the high temperature is required. Therefore, the search for a transparent conductive film to replace ITO ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08G18/83C08G18/65C08K3/08C08K3/22C08L75/04
CPCC08G18/65C08G18/83C08K3/08C08K3/22C08L75/04C08G18/44C08G18/48C08G18/6208C08G18/75C08L75/14C09D175/14
Inventor 内田博米田周平大籏英树中泽惠理鸟羽正彦山木繁
Owner RESONAC CORPORATION