Device for controlling discharging of chip package matching auxiliary materials

Abstract

The invention discloses a device for controlling discharging of chip package matching auxiliary materials, and relates to the field of semiconductor chip packaging equipment. The device comprises an electric control cabinet, a workbench, a heat preservation box, a feeding mechanism, a fed material picking mechanism and a discharging mechanism. The heat preservation box covers the workbench. The feeding mechanism, the fed material picking mechanism and the discharging mechanism are all arranged on the workbench located inside the heat preservation box. The feeding mechanism comprises a drying agent hopper pushed by a jacking assembly. The fed material picking mechanism is arranged above the drying agent hopper and comprises vacuum suction cups arranged on a transverse moving assembly. One side of the drying agent hopper is provided with the discharging mechanism and a label paper material box. The discharging mechanism comprises a receiving box and a runner, an inlet of the runner is adjacent to the drying agent hopper, and an outlet of the runner leads to the receiving box. The electric control cabinet is located below the workbench. Through the device, the discharged package auxiliary material wasting and storing problems are solved, the function that the appropriate quantity of auxiliary materials are discharged as required can be achieved, and the working efficiency of operators is improved.

Description

technical field [0001] The invention relates to the field of semiconductor chip packaging equipment, in particular to a device for controlling the discharge of supporting auxiliary materials for chip packaging. Background technique [0002] During the packaging process of semiconductor devices, it is necessary to store the humidity indicator card and desiccant in aluminum film bags. After the humidity indicator card and desiccant are unpacked, it involves temporary storage. Different semiconductor devices involve different humidity indicator cards and desiccant, and it is easy for workers to mix materials when packaging. [0003] For example, the Chinese invention patent with the authorized announcement number CN 202414236 U "an automatic feeding mechanism for LED braiding machine" "includes the suction head part, the execution part, the air circuit part and the frame part, and the suction head part includes the suction nozzle , suction nozzle arm and torsion spring, the su...

AI Technical Summary

Problems solved by technology

[0004] The technical problem mainly solved by the present invention is to provide a device for controlling the discharge of auxiliary materials for chip packaging, which solves the problem that different semiconductor devices involve different humidity indicator cards and desiccants in a constant environment, and the problem that workers are easy to mix materials when packaging

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