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Electronic equipment, ultrasonic fingerprint identification device and manufacturing method thereof

A manufacturing method and fingerprint recognition technology, which is applied in character and pattern recognition, acquisition/organization of fingerprints/palmprints, instruments, etc., can solve the problems of restricting the recognition sensitivity of ultrasonic fingerprint recognition devices and low loop efficiency

Active Publication Date: 2017-09-22
SILEAD
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, the current scheme of an ultrasonic fingerprint recognition device using a single piezoelectric material tends to cause low loop efficiency (loop efficiency=transmitting efficiency×receiving efficiency), thereby restricting the recognition sensitivity of the ultrasonic fingerprint recognition device

Method used

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  • Electronic equipment, ultrasonic fingerprint identification device and manufacturing method thereof
  • Electronic equipment, ultrasonic fingerprint identification device and manufacturing method thereof
  • Electronic equipment, ultrasonic fingerprint identification device and manufacturing method thereof

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Embodiment Construction

[0047] In order to enable those skilled in the art to better understand the technical solutions in the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described The embodiments are only some of the embodiments of the present application, but not all of them. Based on the embodiments in this application, all other embodiments obtained by persons of ordinary skill in the art without creative efforts shall fall within the scope of protection of this application.

[0048] Based on the embodiments in this application, all other embodiments obtained by persons of ordinary skill in the art without creative efforts shall fall within the scope of protection of this application. For example, in the following description, forming the second component above the first component may include an embodiment in w...

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Abstract

An embodiment of the invention provides electronic equipment, an ultrasonic fingerprint identification device and a manufacturing method thereof. The method comprises the following steps of forming a first piezoelectric layer and a second piezoelectric layer which are horizontally distributed and are isolated to each other on a substrate layer top, wherein the first piezoelectric layer possesses a specific piezoelectric strain constant and the second piezoelectric layer possesses a specific piezoelectric voltage constant; forming first plane electrodes on tops of the first piezoelectric layer and the second piezoelectric layer; forming a resonant cavity on a substrate layer, and forming a second plane electrode and a third plane electrode which are insulated and isolated to each other in the resonant cavity so as to form a first device, wherein the first plane electrode, the first piezoelectric layer and the second plane electrode are used for realizing ultrasonic emission, and the first plane electrode, the second piezoelectric layer and the third plane electrode are used for realizing ultrasonic receiving; and integrating the first device and a cooperated semiconductor device so as to form the ultrasonic fingerprint identification device. In the embodiment of the invention, loop efficiency and identification sensitivity of the ultrasonic fingerprint identification device can be increased.

Description

technical field [0001] The present application relates to the technical field of ultrasonic fingerprint identification, in particular to an electronic device, an ultrasonic fingerprint identification device and a manufacturing method thereof. Background technique [0002] In the ultrasonic fingerprint identification technology, the main function of the ultrasonic fingerprint identification device is to convert the excitation signal into an ultrasonic wave and emit it in a direction perpendicular to the fingerprint, and at the same time receive the ultrasonic wave reflected by the fingerprint and convert it into a corresponding electrical signal. Therefore, the design of the ultrasonic fingerprint identification device is very critical. [0003] In the design of ultrasonic fingerprint identification device, the preparation of piezoelectric material is also a key point. The piezoelectric materials currently used are generally AlN, lead zirconate titanate piezoelectric ceramic...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06K9/00
CPCG06V40/1306
Inventor 不公告发明人
Owner SILEAD
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