Unlock instant, AI-driven research and patent intelligence for your innovation.

Chip card manufacturing method, and chip card obtained by said method

A chip card and electronic chip technology, applied in the field of chip cards, can solve problems such as productivity, reliability impact on manufacturing output, etc.

Active Publication Date: 2017-09-26
LINXENS HLDG SAS
View PDF8 Cites 1 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Using complex methods to connect antennas and modules has a negative impact on productivity, manufacturing yield, and card reliability during card use

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Chip card manufacturing method, and chip card obtained by said method
  • Chip card manufacturing method, and chip card obtained by said method
  • Chip card manufacturing method, and chip card obtained by said method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0028] According to a mode of implementation of the method for manufacturing a chip card according to the invention, the module 100 is produced on the one hand, and the antenna 200 on the inlay 210 is produced on the other hand (cf. figure 1 ).

[0029] like Image 6 As shown (transparently, that is to say showing the pattern present on both sides of the substrate 101), the individual modules 100 are produced, for example in a known manner, on a double-sided substrate 101, which on one side (terminally referred to as The "contact side" or "front side") has contacts 102 on it, and the other side (termed "back side" or "bonding side") has conductive traces 110 and an electronic chip 120 . The electronic chip 120 is fixed on the substrate 101 using at least one known technique (such as die attachment), and the electronic chip 120 is fixed on the substrate 101 using at least one known technique (such as flip-chip technology, wire bonding, etc.). The chip is electrically connecte...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention relates to a chip card manufacturing method. According to said method, the following are produced: a module comprising a substrate supporting contacts on one surface and conductive paths and a chip on the other; and an antenna (200) on a holder, the antenna comprising a contact pad (220) for respectively connecting to each of the ends thereof. A solder drop (230) is placed on each of the contact pads (220) of the antenna (200). The holder of the antenna (200) is then inserted between plastic layers. A cavity (400) is provided, in which the module can be accommodated and the solder drops (230) remain accessible. The height of the solder drops before heating is suitable for projecting into the cavity. A module is then placed in each cavity (400). The areas of the module that are located on the solder drops (230) are then heated such as to melt the solder and to solder the contact pads (220) of the antenna (200) to conductive paths of the module.

Description

technical field [0001] The invention relates to the field of chip cards. Chip cards are well known to the public for which they have many uses: payment cards, SIM cards for mobile phones, transport cards, identity cards, etc. Background technique [0002] Chip cards have transmission means for transmitting data from the electronic chip (integrated circuit) to the card reader (reading) or from the card reader to the card (writing). These transfer devices can be "contact" or "contactless" devices, or have a dual interface when they combine both. In particular, the invention enables the production of dual interface chip cards. A dual interface chip card is called a "dual" card if a single chip is utilized to manage both "contact-based" and "contactless" modes; or, if two physically separated chips are utilized to manage "contact-based" and "contactless" contactless" mode, these chip cards are called "hybrid" cards. [0003] Dual interface chip cards usually consist of a rig...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): G06K19/077
CPCG06K19/07754G06K19/07769G06K19/067G06K19/077G06K19/07722G06K19/07747G06K19/07749G06K19/0775H01L2224/16225H01L2224/16227H01L2924/15H01L2924/18161H01L2924/18165
Inventor E·埃马尔C·普鲁瓦耶N·盖里诺
Owner LINXENS HLDG SAS