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Systems and methods for high yield work-in-process buffering

A buffer system and subsystem technology, applied in semiconductor/solid-state device manufacturing, storage devices, electrical components, etc., can solve the problems of increasing the precious space of the loading port, increasing the size of the environmental shell, and increasing the operating cost

Active Publication Date: 2021-08-03
KLA CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

For example, increasing the number of load ports consumes valuable space on the process line, increases travel requirements for wafer processing systems (e.g., AMHS), and increases the size of the environmental enclosures surrounding semiconductor device fabrication line tools, all of which increase operating costs and increased maintenance needs

Method used

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  • Systems and methods for high yield work-in-process buffering
  • Systems and methods for high yield work-in-process buffering
  • Systems and methods for high yield work-in-process buffering

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Embodiment Construction

[0027] Reference will now be made in detail to the disclosed subject matter which is illustrated in the accompanying drawings.

[0028] generally refer to Figures 1A to 6 In accordance with one or more embodiments of the present invention, systems and methods for providing high throughput buffering for semiconductor device fabrication line tools are described. Embodiments of the present invention relate to cushioning systems including retractable shelves associated with semiconductor device fabrication line tools. Additional embodiments relate to buffer systems including lift assemblies and slide assemblies to transport sealable containers between retractable racks and load ports of semiconductor device fabrication line tools. Embodiments of the present invention provide for horizontal and vertical transport of sealable containers. Furthermore, embodiments of the present invention provide efficient use of space around semiconductor device fabrication line tools, which in tu...

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PUM

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Abstract

A buffer system for a semiconductor device fabrication tool comprising: one or more retractable shelves; one or more slide assemblies positionable over one or more load ports of the semiconductor device fabrication tool; and a or multiple lift assemblies. The one or more retractable shelves are configured to support sealable containers. The one or more slide assemblies are configured to receive the sealable container and are further configured to deliver the sealable container to one or more locations below one or more retractable shelves. The one or more lift assemblies are configured to enable sealable containers in a group comprising one or more retractable shelves, the one or more slide assemblies, and the one or more load ports any transport between the two.

Description

[0001] Cross References to Related Applications [0002] This application is based on 35 U.S.C. §119(e) claiming the rights of U.S. Provisional Application Serial No. 62 / 113,376, filed on February 7, 2015, entitled HIGH THROUGHPUT WORK IN PROCESS BUFFER, the invention The author is Michael Brain (Michael Brain), the entire content of the provisional application is incorporated herein by reference. technical field [0003] The present invention relates generally to semiconductor device fabrication line tools, and more particularly, the present invention relates to a high yield buffer system for process flow management of semiconductor device fabrication line tools. Background technique [0004] The process flow in a modern semiconductor device fabrication line uses a large number of fabrication steps performed by a series of semiconductor fabrication tools. In some cases, a process flow may contain over 800 process steps in a reentrant flow in a set of semiconductor device ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/677
CPCH01L21/67706H01L21/67736H01L21/67769H01L21/67775H01L21/67718B65G1/026H01L21/67715H01L21/67742
Inventor 迈克尔·布雷恩
Owner KLA CORP