A set-position control process of laser positioning nickel plate

A nickel plate and process technology, which is applied in the field of nickel plate production of packaging products, can solve the problems of affecting the positioning accuracy and wasting resources, and achieve the effects of easy alignment of patterns, saving design costs, and enhancing accuracy

Active Publication Date: 2019-04-19
中丰田光电科技(珠海)有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] When the nickel plate is produced, the electroplating solution needs to reach a certain temperature to carry out plasma exchange, so as to adhere to the surface of the master plate. However, due to the influence of temperature and rotation speed, the nickel plate will shrink or expand to varying degrees, which will affect the accuracy of the sleeve. Spend
Problems and shortcomings in the existing technology: 1. The existing technology can only adjust the positioning accuracy of the positioning plate by designing the pattern. Once there is a slight deviation, it needs to be redesigned, wasting resources

Method used

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  • A set-position control process of laser positioning nickel plate
  • A set-position control process of laser positioning nickel plate
  • A set-position control process of laser positioning nickel plate

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Embodiment Construction

[0016] Preferred embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings.

[0017] Figure 4 Show the specific implementation mode of the present invention: a set position product finds the set position deviation 0.5MM in the longitudinal direction after the nickel plate comes out, utilizes the above-mentioned technological method to deal with the deviation correction step and gathers as follows:

[0018] (1) First, the longitudinal direction of the nickel plate and the rotation direction of the mold core on the cathode rod are pasted at 180 degrees to form the cathode master plate mold core;

[0019] (2) Then adjust the temperature of the electroforming solution to 61°C;

[0020] (3) When the temperature of the electroforming solution reaches 61°C, put in the affixed cathode master mold core, plug in the power supply and start electroplating. After 3.2 hours, the thickness of the sub-plate reaches 100um and can be ...

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PUM

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Abstract

The invention discloses a position alignment control technology of a laser locating nickel plate. The position alignment control technology employs the temperature and speed direction matching correspondence rule, and carries out contraction or expansion correction with the combination of the deviation of design pattern, thus the perfect position alignment effect is achieved. The position alignment control technology has the following advantages that one, the position alignment control precision is improved, the alignment to a pattern is easy during printing, and directional printing is realized; and two, the design cost is saved, and rejects of membranes and paper and rejects caused by the fact that the position alignment in printing is not precise in a production process are reduced substantially.

Description

technical field [0001] The invention relates to the field of production, in particular to a production method suitable for the production of nickel plates for packaging products and precise positioning patterns. Background technique [0002] When the nickel plate is produced, the electroplating solution needs to reach a certain temperature to carry out plasma exchange, so as to adhere to the surface of the master plate. However, due to the influence of temperature and rotation speed, the nickel plate will shrink or expand to varying degrees, which will affect the accuracy of the sleeve. Spend. Problems and shortcomings in the prior art: 1. The prior art can only adjust the positioning accuracy of the positioning plate by designing the pattern. Once there is a slight deviation, it needs to be redesigned, which wastes resources. 2. The processing technology of the nickel plate itself will cause certain changes in the positioning of the design patterns. The new technology is t...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C25D1/10C25D21/12
CPCC25D1/10C25D21/12
Inventor 胡文喜莫卧龙
Owner 中丰田光电科技(珠海)有限公司
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