Wafer processing method
A processing method and wafer technology, applied in metal processing equipment, manufacturing tools, laser welding equipment, etc., can solve the problems of meandering cuts and inability to grow cracks
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[0021] figure 1 The illustrated wafer W is an example of a workpiece having a circular plate-shaped substrate. On the front surface Wa of the wafer W, devices D are formed in a plurality of regions divided by a plurality of first planned dividing lines S1 and a plurality of second planned dividing lines S2, wherein the plurality of first planned dividing lines S1 The plurality of second planned division lines S2 extend in a second direction intersecting the plurality of first planned division lines S1 , for example, in a predetermined direction, such as a first direction. On the other hand, the surface of the wafer W opposite to the front surface Wa becomes the back surface Wb to be ground. The wafer W is, for example, a silicon wafer whose crystal orientation has an angle of 45° with respect to the extending direction of the first planned dividing line S1 and the second planned dividing line S2, and has a crystal orientation oriented at 45° with respect to the crystal orient...
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