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Package structure and airtightness detection method and manufacture method thereof

A technology of packaging structure and airtightness, which is applied in fluid tightness testing, machine/structural component testing, application of light to test fluid tightness, etc., can solve inevitable, subjective judgment errors and other problems, and achieve reliable and automatic detection high degree of effect

Inactive Publication Date: 2017-11-07
BOE TECH GRP CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
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Problems solved by technology

[0002] In related technologies, such as photovoltaic devices, display devices and other devices that use packaging structures, the sealing performance between the double-layer plates needs to be observed and tested by manual contact with the packaging structure. There are subjective judgment errors, and it is inevitable that there will be Hidden dangers such as entering particulate impurities or scratching the packaging structure

Method used

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  • Package structure and airtightness detection method and manufacture method thereof
  • Package structure and airtightness detection method and manufacture method thereof
  • Package structure and airtightness detection method and manufacture method thereof

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Embodiment Construction

[0038] Embodiments of the present invention are described in detail below, examples of which are shown in the drawings, wherein the same or similar reference numerals designate the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the figures are exemplary only for explaining the present invention and should not be construed as limiting the present invention.

[0039] The encapsulation structure 1 according to the embodiment of the present invention will be described below with reference to the accompanying drawings.

[0040] Such as Figure 1-Figure 5 As shown, the package structure 1 according to the embodiment of the present invention includes a package cover plate 100 and a base substrate 200 .

[0041] The base substrate 200 and the package cover 100 are disposed opposite to each other. The encapsulant 300 is formed between the base substrate 200 and the package cover 100 for connecting ...

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Abstract

The invention discloses a package structure and an airtightness detection method and a manufacture method thereof, a display device and a photovoltaic device. The package structure comprises a substrate and a package cover plate, which are arranged oppositely; and package glue formed between the substrate and the package cover plate and used for connecting the substrate and the package cover plate to form a seal space, wherein the package glue is mixed with a fluorescent agent. The package structure has the advantages of reliable detection and high automation degree and the like.

Description

technical field [0001] The present invention relates to the technical field of packaging structures, in particular, to a packaging structure, a sealing detection method and a manufacturing method thereof, a display device and a photovoltaic device. Background technique [0002] In related technologies, such as photovoltaic devices, display devices and other devices that use packaging structures, the sealing performance between the double-layer plates needs to be observed and tested by manual contact with the packaging structure. There are subjective judgment errors, and it is inevitable that there will be There are hidden dangers such as particulate impurities or scratches on the packaging structure. Contents of the invention [0003] The present invention aims to solve at least one of the technical problems existing in the prior art. Therefore, the present invention proposes a packaging structure, which has the advantages of reliable detection and high degree of automati...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/29H01L21/66H01L31/048G01M3/00
CPCG01M3/00H01L22/12H01L23/29H01L31/0481H10K59/8722Y02E10/50G01M3/20G01M3/38H10K50/8426H10K59/00
Inventor 范晓旺张亮
Owner BOE TECH GRP CO LTD
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