Ultrathin isothermal plate and method for preparing same

A vapor chamber, ultra-thin technology, used in electrical equipment structural parts, modification by conduction heat transfer, cooling/ventilation/heating transformation, etc., can solve the problem of thermal conductivity, large span, and overall support of the vapor chamber. and other problems to achieve the effect of improving thermal conductivity, improving thermal conductivity, and improving reflow speed

Pending Publication Date: 2017-11-07
SUZHOU TIANMAI THERMAL TECH
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, due to the large span in the length and width directions of the vapor chamber, there are defects in the overall support of the vapor chamber, which is most obvious in ultra-thin vapor chambers, and ultimately affects the heat conduction effect

Method used

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  • Ultrathin isothermal plate and method for preparing same

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Embodiment

[0028] This embodiment discloses a method for preparing an ultra-thin vapor chamber, which includes the following steps,

[0029] (1) Take the first shell and the second shell of the flat structure, and sinter the capillary liquid-absorbing core on the above-mentioned first shell and the second shell; the above-mentioned first shell and the second shell are arranged facing up and down , and the capillary liquid-absorbent cores of both are arranged on the inside of their respective shells;

[0030] (2) The supporting structure is centrally placed between the first casing and the second casing, and the supporting structure is inserted between the capillary liquid-absorbing cores of the first casing and the second casing;

[0031] (3) The first shell and the second shell are welded into a tube sheet structure with a cavity inside, and a seal is reserved on the side of the tube sheet; the above-mentioned supporting structure is centered and covered in the cavity of the tube sheet;...

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Abstract

The invention provides a method for preparing an ultrathin isothermal plate. The method comprises the following steps of: (1) taking a first housing and a second housing in flat plate shapes, sintering capillary imbibition cores on the first housing and the second housing; (2) placing a support structure centrally between the first housing and the second housing, wherein the support structure is interposed between the capillary imbibition cores of the first housing and the second housing; (3) welding the first housing and the second housing into a tube plate structure having a cavity therein, and reserving a sealing opening on the side edge of the tube plate, wherein the support structure is centrally encased in the cavity of the tube plate; (4) vacuum-pumping the inside of the tube plate from the sealing opening; (5) injecting a working medium into the tube plate from the sealing opening; and (6) heat-sealing the sealing opening to form a closed cavity inside the tube plate. The method for preparing an ultrathin isothermal plate can solve the intermediate support problem of the isothermal plate and improve the thermal conductivity of the isothermal plate. The temperature difference between any bright spots on the isothermal plate can be controlled within 10 degrees centigrade.

Description

technical field [0001] The invention belongs to the technical field of heat dissipation, and in particular relates to an ultra-thin vapor chamber and a preparation method thereof. Background technique [0002] At present, servers, display adapters and other electronic devices that are easy to accumulate or generate high heat are mostly realized by fans or heat dissipation modules in traditional heat management. The heat dissipation module is composed of solid die-casting parts, heat pipes, heat exchange fins, and fans. The combination of heat pipes and die-casting parts has a better heat dissipation effect than a single die-casting part. However, the temperature difference between the near heat source point and the far heat source point on the heat dissipation base can still reach more than 10°C, and the heat dissipation effect is still not ideal. In order to solve this technical problem, the industry continues to develop and produce vapor chambers. The vapor chambers have a...

Claims

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Application Information

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IPC IPC(8): H05K7/20
CPCH05K7/20336H05K7/20509
Inventor 丁幸强
Owner SUZHOU TIANMAI THERMAL TECH
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