Top electrode assembly and plasma processing equipment

An electrode assembly and a main body technology are applied in the field of plasma treatment equipment, which can solve the problems of low heat conduction efficiency between a mounting substrate and a gas shower head, and achieve the effect of improving heat conduction and reducing pollution.

Active Publication Date: 2021-05-25
ADVANCED MICRO FAB EQUIP INC CHINA
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Among them, in the process of using the capacitively coupled plasma processing equipment to process the substrate to be processed, the heat conduction efficiency between the mounting substrate and the gas shower head is low

Method used

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  • Top electrode assembly and plasma processing equipment
  • Top electrode assembly and plasma processing equipment
  • Top electrode assembly and plasma processing equipment

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Embodiment Construction

[0035]Next, the technical scheme in the present application embodiment will be described in the present application, and it is understood that the described embodiments are intended to be described herein, not all of the embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without making creative labor premises, all of the present application protected.

[0036]There are many specific details in the following description to facilitate the apparatus, but the present application can also employ other other ways unlike otherwise described herein, those skilled in the art can do without violating the contents of this application. Similarly, the present application is not limited by the specific embodiments disclosed in the following.

[0037]As in the context of the background, the heat conduction efficiency of the mounting substrate and the gas shower head is low in the process of pro...

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Abstract

A top electrode assembly is characterized in that a first heat conduction structure is arranged between a mounting substrate and a gas spraying head so as to improve the heat conduction effect between the mounting substrate and the gas spraying head; moreover, the gas spraying head comprises a main body part and a convex part positioned on the main body part; the main body part is provided with a plurality of first gas outlets; the convex part is provided with a plurality of second gas outlets; the first gas outlets and the second gas outlets are in one-to-one correspondence; the first gas outlets and the second gas outlets communicate to form gas outlets; the second gas outlets penetrate through a first through hole of the first heat conduction structure and extends into a first vent hole of the first mounting substrate; thus, when process gas introduced into the first vent hole passes through the first heat conduction structure, small particles on the first heat conduction structure can be brought to the to-be-processed substrate only along the side walls and the tops of the convex part and then along the gas outlets, and therefore pollution of the small particles to the to-be-processed substrate can be reduced easily through the top electrode assembly.

Description

Technical field[0001]The present application relates to the field of plasma processing, and more particularly to an upper electrode assembly and a plasma processing apparatus.Background technique[0002]With the continuous development of plasma processing technology, the plasma processing equipment for which this technology is applied is constantly improving. Several plasma processing equipment, such as capacitive coupling plasma (ie, Capacitivelycoupled Plasma, CCP) processing equipment, Inductive Planma, ICP) treatment equipment and Electron cyclotron resonance (ECR) processing equipment. Among them, in the process of processing the substrate to be treated with a capacitive coupling plasma processing apparatus, the thermally conductive efficiency of the mounting substrate and the gas showerhead is low.Inventive content[0003]In order to solve the above technical problems, the present application provides an upper electrode assembly to increase the heat conduction efficiency of the mo...

Claims

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Application Information

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IPC IPC(8): H01J37/32
CPCH01J37/32091H01J37/3244H01J37/32724Y02P70/50
Inventor 杨金全黄允文
Owner ADVANCED MICRO FAB EQUIP INC CHINA
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